Dynamic Liquid Cooling for Compute Components
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Solution Overview
Problem
Current liquid cooling systems for electronic components in high-performance systems, such as data centers and edge computing environments, face challenges in dynamically managing cooling resources to meet varying thermal demands and service-level agreements (SLAs), particularly in efficiently distributing and reusing heat across the infrastructure.
Innovation Solution
The implementation of a liquid cooling system with dynamic cooling parameter adjustments and workload management based on sensor telemetry and performance data, utilizing immersion tanks for single-phase or two-phase cooling, and advanced orchestration to create heatmaps for resource allocation and heat reuse strategies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used to address thermal management risks in high-performance systems, then cooling effectiveness is improved, but system complexity increases
Solution Approach 1:
The system dynamically adjusts cooling parameters (flow rate, temperature) based on real-time thermal conditions and workload demands. The cooling system transitions from static to dynamic operation, allowing it to adapt to varying thermal management risks while maintaining optimized performance without requiring overly complex infrastructure.
Solution Approach 2:
The patent changes operational parameters of the cooling system (flow rate, temperature, phase state) based on detected thermal conditions and workload characteristics. By adjusting these parameters dynamically, the system achieves effective cooling without requiring permanently complex hardware configurations.
2Productivity
If dynamic cooling parameter adjustments are implemented to meet varying thermal demands, then thermal management efficiency is improved, but control system complexity increases
Solution Approach 1:
The system implements feedback mechanisms that continuously monitor thermal conditions, workload demands, and cooling performance. This feedback loop enables automatic adjustment of cooling parameters to meet varying thermal demands efficiently, with the control system learning from operational data to optimize performance without requiring excessively complex control architecture.
Solution Approach 2:
The cooling system performs self-adjustment based on detected thermal conditions and workload characteristics. The system autonomously optimizes its own operation by detecting thermal risks and adjusting cooling parameters accordingly, reducing the need for external complex control mechanisms.
3Loss of energy
If heat reuse strategies are implemented across the infrastructure, then resource efficiency is improved, but system integration complexity increases
Solution Approach 1:
The patent merges the cooling function with heat reuse functionality into an integrated system. By combining these functions, the system recovers thermal energy from cooling operations and reuses it for other purposes (such as heating or pre-cooling), improving overall resource efficiency without requiring completely separate complex systems.
Solution Approach 2:
The cooling system is designed to perform multiple functions: primary cooling, heat recovery, and heat reuse. This multi-functionality allows the system to improve resource efficiency by utilizing recovered heat for various applications while maintaining a unified rather than multiply-complex architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient cooling resource distribution, meets SLA temperature requirements, and optimizes resource utilization by dynamically adjusting cooling and workload parameters, allowing for the reuse of heat across the system, thereby improving thermal management and resource efficiency.
Implementation Method 1
Air cooling can be used to cool electronic components by facilitating airflow over the electronic components to promote dissipation of heat
Implementation Method 2
the use of liquids to cool electronic components is being explored to address thermal management risks
Implementation Method 3
utilizing immersion tanks for single-phase or two-phase cooling
Data Source
AI summary
Systems, apparatus, and methods for managing cooling of compute components are disclosed. An example apparatus includes programmable circuitry to at least one of instantiate or execute machine readable instructions to identify a workload to be performed by a compute device, identify a service level objective associated with the workload or the compute device, determine a parameter of a coolant to enable the service level objective to be satisfied during performance of the workload, and cause a cooling distribution unit to control the coolant based on the coolant parameter.