Dynamic Memory Configuration for Thermal Reliability
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Solution Overview
Problem
Conventional memory configuration settings in information handling systems are not optimized for varying temperatures, leading to unreliable memory operation at temperatures deviating from the initial arbitrary test temperature, causing thermally-induced failures and making it difficult to identify faulty components.
Innovation Solution
The system creates and modifies memory configuration settings for different temperature ranges by performing margining tests at various temperatures and storing these settings in non-volatile memory, allowing for dynamic selection and application of optimized settings based on current temperature, thereby preventing memory failures and reducing unnecessary repairs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single set of memory configuration settings is configured at boot temperature, then the system can initialize memory during power-on-self-test, but the memory operation becomes unreliable at temperatures deviating from the initial test temperature
Solution Approach 1:
The system dynamically selects memory configuration settings based on the current memory temperature. Multiple sets of memory configuration settings are stored, each optimized for different temperature ranges. The system monitors temperature and automatically switches between different configuration sets to maintain reliable memory operation across varying thermal conditions.
Solution Approach 2:
The invention changes the memory configuration parameters (timing, drive voltage, frequency) based on temperature conditions. Different parameter sets are established for different temperature ranges through margining tests, allowing the system to adapt memory operation parameters to match current thermal environments and maintain stability.
2Productivity
If margining tests are performed at a single temperature, then the test process is simple and quick, but the determined memory configuration settings fail to account for thermal variations
Solution Approach 1:
The margining test process is segmented into multiple temperature-point tests. Instead of performing one comprehensive test at a single temperature, the system performs separate margining tests at multiple discrete temperature points (e.g., cold, ambient, hot conditions). Each test determines configuration settings specific to that temperature range, ensuring comprehensive thermal coverage.
Solution Approach 2:
The system performs margining tests in advance at multiple predetermined temperature points and stores the results as lookup tables. This preliminary action at factory or calibration conditions allows the system to quickly retrieve pre-determined configuration settings during operation, avoiding the need to perform time-consuming tests during each temperature change.
3Reliability
If memory configuration settings are optimized for different temperature ranges, then memory operation reliability improves across temperatures, but the system complexity increases
Solution Approach 1:
The system creates multiple copies of memory configuration settings, each optimized for different temperature ranges. These copies are stored in a structured format (such as lookup tables in non-volatile memory) and selected based on current temperature conditions. This copying approach allows the system to maintain simplicity in operation while achieving complex thermal adaptation through pre-computed configuration replicas.
Data Source
AI summary
Systems and methods are provided for creating and/or modifying memory configuration settings (e.g., such as memory timing and memory drive voltage) for use at selected and/or varying memory temperature/s. The disclosed systems and methods may be implemented to create a relationship between optimized memory configuration settings for different memory temperatures during burn-in testing and/or on an ad-hoc basis.