Dynamic Mounting Tool Control for Solder Drying Defects
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Solution Overview
Problem
Conventional electronic component mounting systems face defects due to solder drying, leading to prohibited processing for many circuit boards, especially with large boards or during short stoppages, as the allowance time is set too short, and solder can dry before components are mounted.
Innovation Solution
An electronic component mounting system that includes a solder printer, a mounter with a board holding device, component supply device, and a mounting device, along with an elapsed time acquiring section and a raising and lowering operation changing section, which adjusts the component holding tool's operation based on the elapsed time since printing to prevent solder drying defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the allowance time is set to be short to prevent solder drying defects, then mounting reliability is improved, but processing productivity deteriorates because many circuit boards are prohibited from processing
Solution Approach 1:
The patent applies dynamics by making the component holding tool's raising and lowering operations variable based on elapsed time. The control section adjusts the pressing force, pressing time, or both, dynamically according to how much time has passed since solder printing, allowing the system to adapt to changing solder conditions rather than using fixed parameters
Solution Approach 2:
The patent changes physical parameters of the mounting process by adjusting pressing force and pressing time based on elapsed time. When solder begins to dry, the system increases pressing force and/or extends pressing time to compensate for reduced solder adhesion, thereby maintaining mounting reliability without prohibiting processing
2Reliability
If the allowance time is set to be short to prevent solder drying, then component holding power is improved, but the number of processable circuit boards deteriorates
Solution Approach 1:
The patent changes physical parameters of the mounting process by adjusting pressing force and pressing time based on elapsed time. When solder begins to dry, the system increases pressing force and/or extends pressing time to compensate for reduced solder adhesion, thereby maintaining component holding power without prohibiting processing
3Productivity
If the mounting process continues without stopping for large circuit boards, then productivity is improved, but solder drying occurs causing mounting defects
Solution Approach 1:
The patent applies dynamics by making the component holding tool's raising and lowering operations variable based on elapsed time. The control section adjusts the pressing force, pressing time, or both, dynamically according to how much time has passed since solder printing, allowing the system to adapt to changing solder conditions during continuous processing of large boards
Solution Approach 2:
The patent changes physical parameters by adjusting pressing force and pressing time based on elapsed time. For large circuit boards where processing takes longer, the system automatically increases pressing parameters for components mounted later to compensate for solder drying, maintaining mounting quality without interrupting productivity
Data Source
AI summary
An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.