Dynamic On-Die Termination for Longer Parallel Bus Packages

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Solution Overview

Problem

In multi-chip packages, existing signal termination methods such as high impedance and static on-die termination either limit package length due to signal reflections or impact direct current margins, making it difficult to implement debug tools effectively.

Innovation Solution

Dynamic on-die termination (ODT) is employed, which adjusts termination voltage based on received signals in a single-ended parallel bus configuration, using a bus holder circuit with hysteresis, a time delay circuit, and a time blanking circuit to prevent noise interference and ringing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high impedance or static on-die termination is used, then signal termination is achieved, but package length is limited due to signal reflections

Engineering Contradiction:
Improvesignal terminationVSAvoidpackage length
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent applies dynamic on-die termination (ODT) that automatically adjusts termination impedance based on the operational state of the device. When the device is inactive, ODT enables low impedance termination to reduce signal reflections and allow longer package lengths. When the device becomes active, ODT switches to high impedance state to maintain proper signal levels. This dynamic switching resolves the contradiction between achieving good signal termination and supporting longer package lengths.

Inventive Principle:
Principle #15Dynamics

2Reliability

If static on-die termination is used, then signal reflections are reduced, but direct current margins are impacted

Engineering Contradiction:
Improvesignal reflection reductionVSAvoiddirect current margins
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The dynamic ODT circuit switches between low impedance state (when inactive) to reduce signal reflections and high impedance state (when active) to preserve DC margins. This dynamic behavior eliminates the need for static termination that would continuously degrade DC margins, thereby resolving the contradiction between reflection reduction and DC margin preservation.

Inventive Principle:
Principle #15Dynamics

3Reliability

If termination voltage is applied immediately, then signal termination is effective, but noise interference and ringing occur

Engineering Contradiction:
Improvesignal termination effectivenessVSAvoidnoise interference and ringing
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent incorporates a time delay circuit that delays the application of termination voltage until after the signal transition has occurred. This preliminary timing arrangement ensures that termination is applied at the optimal moment, avoiding noise interference and ringing that would result from immediate termination voltage application, while still maintaining effective signal termination.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Dynamic ODT reduces signal reflections, allows for longer package lengths without impacting DC levels, and supports higher frequency debug signals while maintaining strict eye height margins.

Implementation Method 1

a bus holder circuit with hysteresis

Methodology Applied
Scientific EffectHysteresis: Hysteresis

Data Source

PatentUS10812075B2Dynamic on-die termination
Publication Date: 2020.10.20 INTEL CORP
  • US10812075B2 patent drawing
  • US10812075B2 patent drawing
  • US10812075B2 patent drawing

AI summary

An apparatus includes a terminal, a first device coupled to the terminal via a first node, the first device to drive a signal on the terminal via the first node, and a second device coupled to the terminal via a second node, wherein the second device comprises a dynamic on-die termination (ODT) circuit coupled to the second node. The dynamic ODT circuit includes: a bus holder circuit to receive the signal from the first device at the second node and select a termination voltage based on the signal, a response delay circuit coupled to the bus holder circuit, the response delay circuit to delay application of the termination voltage to the second node, and a time blanking delay circuit coupled to the bus holder circuit and the response delay circuit to prevent the termination voltage from changing before a threshold period of time elapses.