Dynamic Power Gate Control for Stable Gated Grid Voltage

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional power gating methods in integrated circuits often result in inefficiencies due to voltage drops and increased power dissipation when actual current draw is less than anticipated, leading to higher than target gated grid voltage and reduced power efficiency.

Innovation Solution

Implementing a control system that selectively enables and disables subsets of power gates based on real-time load conditions, adjusting the resistance between the supply voltage and gated power domain voltage to maintain a target operating voltage, thereby managing short-term voltage fluctuations and optimizing power usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If power gates are enabled to supply power to the gated power domain, then the gated grid voltage increases, but power dissipation through leakage and active power increases

Engineering Contradiction:
Improvegated grid voltageVSAvoidpower dissipation
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent applies dynamics by transitioning from static power gate control (always on or always off) to dynamic control where the number of enabled power gates is adjusted in real-time based on actual current consumption. The control system continuously monitors load conditions and modifies the power gate configuration accordingly, enabling the system to adapt its voltage supply level to match actual demand and minimize unnecessary power dissipation.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by modifying the number of enabled power gates as a controllable parameter. Instead of fixing the power gate configuration, the system varies this parameter based on measured current consumption, thereby dynamically adjusting the gated grid voltage to optimal levels that reduce leakage and active power dissipation while maintaining adequate supply voltage.

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If the number of power gates is reduced to decrease resistance, then power dissipation decreases, but the gated grid voltage may drop below target levels

Engineering Contradiction:
Improvepower dissipationVSAvoidgated grid voltage
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The patent employs feedback by implementing a control system that continuously monitors the actual current consumption of the gated power domain and uses this information to adjust the number of enabled power gates. This closed-loop feedback mechanism ensures that the gated grid voltage is maintained at appropriate levels while minimizing power dissipation, as the system responds to actual load conditions rather than operating with fixed assumptions.

Inventive Principle:
Principle #23Feedback

3Reliability

If power supply voltage is set based on maximum load conditions, then reliability is improved, but power efficiency decreases when actual load is lower

Engineering Contradiction:
Improvepower supply stabilityVSAvoidpower efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent resolves this contradiction by making the power supply configuration dynamic rather than static. Instead of setting the power supply voltage based on maximum load conditions for all operating scenarios, the system dynamically adjusts the number of enabled power gates to match actual load demands. This ensures reliable power supply during high-load conditions while improving power efficiency during low-load operations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent applies parameter changes by adjusting the number of enabled power gates based on actual current consumption measurements. This variable parameter approach replaces the fixed parameter approach of setting voltage for maximum load, allowing the system to optimize the balance between reliability and power efficiency across different operating conditions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a consistent target voltage across the gated power domain, enhancing power efficiency by dynamically adjusting power gate resistance in response to changes in current consumption, thereby minimizing leakage and active power dissipation.

Implementation Method 1

A gated grid voltage may differ from a power supply voltage based on the resistance of the power gates and current consumption of the corresponding gated power domain, in accordance with Ohm's law.

Methodology Applied
Scientific EffectOhm's law: Ohm's Law

Data Source

PatentUS10955885B2Methods and systems to control power gates during an active state of a gated domain based on load conditions of the gated domain
Publication Date: 2021.03.23 INTEL CORP
  • US10955885B2 patent drawing
  • US10955885B2 patent drawing
  • US10955885B2 patent drawing

AI summary

Methods and systems to adjust a resistance between a supply grid and a power-gated grid during an active state of a power-gated circuitry in response to load changes in the circuitry to maintain a relatively consistent IR droop. Subsets of power gates (PGs) may be selectively enabled and disabled based on changes in a load factor, such as a voltage, which may be monitored at a gated power distribution grid and/or proximate to a transistor gate within the power-gated circuitry. The adjusting may be performed to minimize a difference between the monitored voltage and a reference, such as with successive approximation or CMS software. PG subsets may be distributed within one or more layers of an integrated circuit (IC) die and may be selectively enabled/disabled based on location. PGs may be embedded within lower layers of an integrated circuit (IC) die, such as within metal layers of the IC die.