Dynamic Pushing for Topological Routing of Semiconductor Packages
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Solution Overview
Problem
Conventional topological routing techniques for semiconductor packages, such as System-in-a-Package (SiP), face challenges in flexibility due to limited bond-pad and escape break point locations, leading to obstacles for other nets and net ordering issues, especially in high-density, non-Manhattan planar routing scenarios.
Innovation Solution
The implementation of a particle-insertion-based constraint Delaunay triangulation (PCDT) and its dual, combined with a dynamic search routing algorithm (DS*), allows for dynamic pushing and detouring of wires to find the shortest path and optimize routing, while controlling parameters manage congestion and wire length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional topological routing techniques are used with limited bond-pad and escape break point locations, then routing structure is simplified, but routing flexibility is reduced and net ordering problems occur
Solution Approach 1:
The patent implements dynamic pushing techniques where already-routed nets can be automatically pushed or detoured when new nets require routing paths. This dynamic adjustment allows the routing structure to adapt flexibly to different net requirements without fixing bond-pad and escape break point locations rigidly, resolving the contradiction between simplified routing structure and reduced routing flexibility.
2Ease of manufacture
If conventional topological routing is performed, then routing process is straightforward, but obstacles are created for other nets and net ordering issues arise
Solution Approach 1:
The patent incorporates feedback mechanisms where the routing system continuously monitors and evaluates routing paths. When a new net requires routing, the system evaluates existing net positions and automatically pushes or detours those nets if they obstruct the new net's optimal path. This feedback-driven approach maintains routing process simplicity while eliminating obstacles and net ordering problems that reduce routing efficiency.
3Ease of manufacture
If fixed bond-pad and escape break point locations are used, then manufacturing is simplified, but routing options are limited
Solution Approach 1:
The patent enables dynamic adjustment of effective routing paths through the pushing technique, where nets can be moved from their initial positions. This creates flexible routing options equivalent to having multiple bond-pad and escape break point locations, while the underlying manufacturing structure remains simple and fixed. The dynamic path adjustment provides routing versatility without compromising manufacturing simplicity.
Data Source
AI summary
Techniques are disclosed for performing topologically planar routing of System in Packages (SiPs). A routing graph can be represented by a particle-insertion-based constraint Delaunay triangulation (PCDT) and its dual. A dynamic search routing may be performed using a DS* routing algorithm to determine the shortest path on the dual graph between a start point and an end point. Based on a dynamic pushing technique, net ordering problems may be solved. A first wire can be topologically routed. Dynamic search routing of a second wire may be performed. The first wire may be pushed or detoured in response to the dynamic searching routing of a second wire.