Dynamic Rack Air-Cooling Unit for Hot Air Recirculation Control

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Solution Overview

Problem

Conventional data center cooling systems face challenges in efficiently managing airflow and heat removal, leading to increased temperatures, energy inefficiency, and reliability issues due to hot air recirculation and inefficient air delivery methods.

Innovation Solution

The implementation of a method and air-cooling unit that dynamically adjusts airflow rate and heat removal rate based on real-time data from electronics racks, using air-to-liquid heat exchangers and control units to optimize cooling performance and eliminate hot air recirculation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If increased airflow rates are used to cool high power modules, then cooling effectiveness is improved, but the temperature of exhaust air increases and stresses room air-conditioning capacity

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsensible heat load
Core Design Contradiction:
TemperatureVSPower

Solution Approach 1:

The invention divides the cooling system into modular air-cooling units, each dedicated to cooling a specific rack or group of racks. This segmentation allows each unit to independently manage its airflow and heat removal rates, preventing the cumulative heat load from overwhelming the central air-conditioning system while maintaining effective cooling at each rack level.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The air-cooling units act as intermediary devices between the electronics racks and the room air-conditioning system. They capture and remove heat at the rack level before it enters the general room environment, thereby reducing the sensible heat load on the central air-conditioning system while maintaining effective cooling.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If higher airflow rates are provided to handle increased power dissipation, then cooling capacity is improved, but recirculation of hot air occurs leading to higher rack inlet temperatures

Engineering Contradiction:
Improvecooling capacityVSAvoidrack inlet temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

Each air-cooling unit is configured with localized air intake and exhaust arrangements specific to its associated rack. The air moving devices are positioned to create localized airflow patterns that draw cool air from the front of the rack and exhaust hot air from the rear, preventing hot air from recirculating back to the rack inlet while maintaining high cooling capacity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The air-cooling units incorporate dynamically adjustable air moving devices that can vary their operational characteristics based on real-time conditions. This dynamic adjustment allows the system to optimize airflow rates and prevent recirculation under varying load conditions, maintaining effective cooling while avoiding the formation of recirculating hot air patterns.

Inventive Principle:
Principle #15Dynamics

3Temperature

If more powerful air moving devices are used to increase airflow, then cooling effectiveness is improved, but energy consumption and acoustic noise increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The air moving devices in each air-cooling unit are equipped with dynamic control capabilities that allow adjustment of their operational parameters. The control unit monitors cooling requirements and adjusts the air moving device operation accordingly, ensuring that sufficient airflow is provided for effective cooling while minimizing energy consumption and acoustic noise by avoiding excessive airflow rates.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The control unit receives feedback regarding the cooling requirements of the electronics rack and dynamically adjusts the operation of the air moving devices. This feedback mechanism ensures that the air moving devices operate at optimal levels to achieve effective cooling without consuming excessive energy or generating unnecessary acoustic noise.

Inventive Principle:
Principle #23Feedback

4Device complexity

If fixed airflow rates are used in conventional cooling systems, then system simplicity is maintained, but adaptability to varying heat loads is reduced

Engineering Contradiction:
Improvesystem simplicityVSAvoidadaptability to heat load
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

Each air-cooling unit incorporates dynamically adjustable components including air moving devices and liquid coolant flow control that can adapt to varying heat loads. The control unit monitors the cooling requirements of the associated rack and adjusts the operational parameters accordingly, providing adaptability to changing conditions while maintaining relatively simple individual unit designs that can be deployed in modular configurations.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces energy consumption, lowers pressure drops, and enhances cooling efficiency, resulting in lower operating costs and improved reliability by ensuring that the cooling capacity matches the actual heat load, thereby reducing temperature gradients and acoustic noise.

Implementation Method 1

an air-to-liquid heat exchanger associated with the housing for cooling air passing through the housing from the air inlet side to the air outlet side

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS7630795B2Method and air-cooling unit with dynamic airflow and heat removal adjustability
Publication Date: 2009.12.08 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US7630795B2 patent drawing
  • US7630795B2 patent drawing
  • US7630795B2 patent drawing

AI summary

Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.