Dynamic Release Tape for Laser Transfer of Discrete Components
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Solution Overview
Problem
Existing methods for assembling discrete components onto substrates are inefficient and costly, particularly when using rigid carrier substrates, which incur high material and refurbishment costs.
Innovation Solution
A method involving a dynamic release tape with a flexible support layer and a multilayer dynamic release structure that uses laser-assisted transfer to release discrete components from the tape, allowing for cost-effective and high-throughput assembly onto substrates without the need for rigid carriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid carrier substrates are used for assembling discrete components, then the components can be held and transferred stably, but the material cost and refurbishment cost increase significantly
Solution Approach 1:
The patent employs a disposable flexible tape carrier instead of expensive rigid substrates. The tape is used once to hold and transfer discrete components, then discarded after the components are transferred to the target substrate, eliminating the need for costly refurbishment of rigid carriers while maintaining stable component holding during the assembly process
Solution Approach 2:
The patent uses a flexible thin-film tape structure with multiple functional layers (carrier layer, adhesion layer, release layer) to replace rigid carrier substrates. This flexible film structure provides sufficient mechanical stability for component holding and transfer while being significantly cheaper and more disposable than rigid carriers
2Productivity
If traditional assembly methods are used, then the process is simple, but the throughput is low and cost is high
Solution Approach 1:
The patent applies adhesion promoter and adhesion enhancer to the flexible tape carrier before mounting the discrete components. This preliminary chemical treatment ensures strong and uniform adhesion of components to the tape, enabling high-throughput parallel assembly and transfer operations without compromising component integrity or increasing per-unit cost
Solution Approach 2:
The patent segments the assembly process by using a flexible tape carrier that can hold multiple discrete components in parallel, allowing simultaneous transfer of multiple components to the target substrate, thereby increasing throughput while maintaining cost-effectiveness through standardized tape units
3Ease of manufacture
If a flexible support layer is used instead of rigid carriers, then material cost is reduced, but the structural stability during positioning may be compromised
Solution Approach 1:
The patent creates a composite multi-layer structure consisting of a flexible carrier layer, adhesion promoter layer, adhesion enhancer layer, and release layer. This composite structure provides the necessary structural stability and component holding strength while maintaining flexibility and low material cost, resolving the contradiction between flexible support and structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, low-cost, and high-throughput assembly of ultra-thin and ultra-small discrete components onto substrates by eliminating the need for expensive rigid carriers and reducing material costs, while maintaining precision and consistency in the transfer process.
Implementation Method 1
irradiating the dynamic release structure to release the discrete component from the dynamic release tape
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.