Dynamic Release Tape Transfer Without Rigid Carrier Support

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Solution Overview

Problem

Existing methods for assembling discrete components onto a substrate face challenges in efficiently and cost-effectively transferring and releasing components from dynamic release tapes, particularly in maintaining the integrity and planarity of the tapes during the transfer process.

Innovation Solution

The use of a dynamic release tape with a flexible support layer and a multilayer dynamic release structure, which includes an absorbing and adhesion layer and an active layer, allows for the laser-assisted transfer of discrete components. This tape is positioned on a support fixture with a transparent support plate, and the dynamic release structure is irradiated to release the components, utilizing the mechanical response of the blistering layer to facilitate transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid carrier substrate is used to support the dynamic release tape, then the tape stability is improved, but the manufacturing cost increases

Engineering Contradiction:

Improvetape stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent removes the rigid carrier substrate from the system, extracting only the essential function of support during transfer. The flexible support layer becomes self-standing, eliminating the need for expensive rigid carriers while maintaining sufficient stability through the transfer fixture and suction mechanisms.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a disposable flexible support layer that can be discarded after single use, replacing expensive rigid carrier substrates. This disposable approach reduces manufacturing costs while the self-standing design ensures adequate stability during the transfer process.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Ease of manufacture

If a flexible support layer is used without rigid support, then the manufacturing cost decreases, but the tape planarity deteriorates

Engineering Contradiction:

Improvemanufacturing costVSAvoidtape planarity

Core Design Contradiction:

Ease of manufactureVSShape

Solution Approach 1:

The patent applies preliminary actions to ensure planarity before the transfer process begins. The flexible support layer is pre-stretched and pre-positioned on the transfer fixture, and suction is applied in advance to flatten any wrinkles or deformities, ensuring the tape is planar when components are released.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses pneumatic suction through the transfer fixture to hold and flatten the flexible support layer against the fixture surface. This pneumatic pressure eliminates wrinkles and maintains planarity throughout the transfer process without requiring rigid structural support.

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Productivity

If the dynamic release tape is irradiated to release components, then the transfer speed increases, but the risk of damaging the flexible support layer increases

Engineering Contradiction:

Improvetransfer speedVSAvoidsupport layer integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by using selective laser irradiation that targets only specific regions where components need to be released. The laser parameters are locally optimized to provide sufficient energy for component release while minimizing thermal damage to the flexible support layer in non-irradiated areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses periodic or pulsed laser irradiation rather than continuous irradiation. This allows brief intervals between pulses for heat dissipation, preventing cumulative thermal damage to the flexible support layer while maintaining high transfer speed through efficient component release.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables high-throughput, low-cost contactless assembly of discrete components onto substrates, maintaining the integrity and planarity of the dynamic release tape during transfer, and reducing the need for expensive rigid carrier substrates.

Implementation Method 1

a dynamic release structure disposed on the flexible support layer... irradiating the dynamic release structure to release the discrete component from the dynamic release tape... utilizing the mechanical response of the blistering layer to facilitate transfer

Methodology Applied

Scientific EffectLight absorption and mechanical response: Absorption (EM radiation)

Data Source

PatentUS12211730B2Dynamic release tapes for assembly of discrete components

Publication Date: 2025.01.28 KULICKE & SOFFA NETHERLANDS BV

AI summary

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.