Dynamic Scheduling for Semiconductor Substrate Conveyance Arms
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate conveyance devices face challenges in maintaining throughput due to predetermined operation schedules, which fail to adapt to varying process processing times, cleaning processing times, and substrate carry-out/in times, leading to unnecessary waiting times and degraded efficiency.
Innovation Solution
A substrate conveyance method and device that utilize a storage unit to store conveyance-sequence categories and operation patterns, allowing for dynamic scheduling based on current processing conditions, including process processing time, cleaning processing time, and substrate carry-out/in time, to optimize the conveyance arm device's operation during cleaning processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If predetermined operation schedules are used for the conveyance arm device, then the operation sequence is simple to manage, but the throughput degrades due to inability to adapt to varying processing conditions
Solution Approach 1:
The patent implements dynamic scheduling where the conveyance arm device's operation sequence is automatically adjusted based on real-time processing conditions. The control unit receives processing time information from multiple processing chambers and dynamically generates optimal conveyance sequences, transforming the static predetermined schedule into a dynamic adaptive system that responds to varying processing requirements.
Solution Approach 2:
The system incorporates feedback mechanisms where the control unit continuously monitors processing conditions and times from multiple processing chambers. Based on this feedback information, the control unit recalculates and adjusts the conveyance arm device's operation sequence to optimize throughput, creating a closed-loop control system that adapts to changing conditions.
2Reliability
If the conveyance arm device waits during cleaning processing, then the cleaning can be performed properly, but the throughput is degraded due to waiting time
Solution Approach 1:
The system performs preliminary actions by scheduling conveyance operations in advance based on predicted cleaning durations. The control unit calculates optimal timing for substrate carry-in and carry-out operations before cleaning begins, allowing the conveyance arm to be ready to act immediately when cleaning completes, minimizing waiting time while ensuring proper cleaning execution.
Solution Approach 2:
The patent maintains continuity of useful action by overlapping conveyance operations with cleaning processing. The conveyance arm device performs substrate carry-in and carry-out operations during the cleaning process rather than waiting idle, ensuring continuous productive activity while cleaning is performed, thereby maintaining throughput without compromising cleaning quality.
3Stability of the object's composition
If fixed conveyance sequences are used, then the system operation is stable, but the system cannot adapt to process condition changes
Solution Approach 1:
The patent transforms the static fixed conveyance sequence into a dynamic adaptive sequence. The control unit continuously monitors processing conditions from multiple processing chambers and automatically adjusts the conveyance arm device's operation sequence in real-time, allowing the system to adapt to varying processing times and conditions while maintaining stable and reliable operation.
Solution Approach 2:
The system changes operational parameters dynamically based on processing conditions. The control unit adjusts conveyance timing, sequence, and speed parameters according to actual processing times and chamber states, enabling the system to adapt to different processing scenarios while maintaining overall operational stability through controlled parameter variations.
Data Source
AI summary
The purpose of the present invention is to accurately deal with a variety of processing conditions and variations thereof, and to improve total throughput by efficiently operating a conveyance arm device in accordance with the processing conditions, even during cleaning. When a first wafer is loaded on a load-lock chamber, a conveyance-sequence category for operating each of a number of steps for a conveyance arm device capable of operating during cleaning is selected in accordance with processing conditions of the wafer, and a plurality of operation patterns are selected, combined and scheduled. The conveyance arm device is controlled in accordance with the scheduled conveyance sequence to control substrate conveyance.