Dynamic Substrate Transfer Sequence for Semiconductor Processing

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Solution Overview

Problem

The productivity of semiconductor device manufacturing is hindered by mismatches between the number of process chambers and substrates, leading to uneven accumulated processing times and maintenance challenges across multiple chambers, resulting in decreased system efficiency and film quality variations.

Innovation Solution

A method is introduced to optimize substrate processing by generating and using first count data to assign transfer flags, allowing substrates to be transferred based on the chamber with the maximum processing data, thereby adjusting the transfer sequence to balance processing loads and maintain consistent chamber conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are transferred to process chambers in a fixed predetermined order, then the transfer process is simple and easy to control, but the accumulated processing times become uneven across chambers leading to reduced productivity

Engineering Contradiction:

Improveproductivity of substrate processing systemVSAvoidcomplexity of transfer sequence control

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The transfer sequence is made dynamic by introducing transfer flag data that changes based on count data from each process chamber. Instead of a fixed predetermined order, the system dynamically adjusts which chamber receives substrates next based on real-time processing counts, allowing the transfer pattern to adapt to chamber utilization levels and balance accumulated processing times.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system uses count data from each process chamber as feedback to determine transfer destinations. The count data reflects the accumulated processing time or number of substrates processed in each chamber, and this feedback information drives the assignment of transfer flags that control subsequent substrate transfers, creating a closed-loop control system that balances chamber utilization.

Inventive Principle:

Principle #23Feedback

2Productivity

If the number of process chambers is increased to handle more substrates, then the processing capacity increases, but the mismatch between chamber number and substrate number leads to uneven processing distribution and reduced efficiency

Engineering Contradiction:

Improveprocessing capacity of substrate processing systemVSAvoidefficiency of substrate processing distribution

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

Count data from each process chamber provides feedback on processing distribution, enabling the system to detect imbalances in substrate allocation across chambers. This feedback mechanism allows the transfer control to adjust and optimize the distribution of substrates to all available chambers, maximizing the utilization of increased chamber capacity.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system changes the transfer destination parameter based on count data values. By monitoring the count data that reflects processing distribution, the system dynamically changes which chamber is selected for the next substrate transfer, ensuring optimal utilization of all process chambers and preventing mismatch-related inefficiencies.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If substrates are continuously transferred to process chambers without balancing processing times, then the transfer speed is maximized, but film quality variations occur due to inconsistent chamber conditions

Engineering Contradiction:

Improveconsistency of film characteristicsVSAvoidtime for balancing processing loads

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs preliminary assessment by generating and storing count data for each process chamber before determining the next transfer destination. This preliminary action of evaluating chamber processing states allows the system to proactively balance loads before imbalances become problematic, preventing film quality variations while minimizing disruptions to the transfer flow.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Count data serves as feedback that monitors chamber processing conditions and guides transfer decisions. By continuously using this feedback to adjust transfer patterns, the system maintains consistent accumulated processing times across chambers, ensuring uniform chamber conditions and consistent film characteristics without requiring extensive time for load balancing corrections.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS10503152B2Method of manufacturing semiconductor device

Publication Date: 2019.12.10 KOKUSAI DENKI KK

AI summary

Described herein is a technique capable of improving the productivity of a substrate processing system including a plurality of process chambers. According to the technique described herein, there is provided a method of manufacturing a semiconductor device, including: (a) placing a storage container accommodating substrates on a loading port shelf; (b) transferring the substrates in a predetermined order from the storage container to process chambers capable of processing the substrates; (c) perform a substrate processing in the process chambers; (d) generating first count data corresponding to the processing chambers; (e) storing the first count data; (f) assigning transfer flag data to one of the process chambers next to another of the process chambers corresponding to a maximum count number of the first count data; and (g) transferring substrates accommodated in a next storage container of the storage container in the predetermined order based on the transfer flag data.