Dynamic Thermal Controller for IC Test Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current thermal systems for testing integrated circuits are limited by their inability to provide accurate, stable, and dynamically adjustable temperature control, especially for complex IC devices with varying thermal management requirements and the need for rapid temperature changes during testing.
Innovation Solution
A test system incorporating a dynamic thermal controller with a thermal control interface and a fast response control loop, using a PID control methodology and digital interfaces for streaming temperature setpoints, allowing for flexible and independent thermal management to accommodate diverse test conditions and applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional fixed temperature setpoint control approach is used, then the temperature control is simple to implement, but it cannot accommodate diverse thermal management requirements of complex IC devices
Solution Approach 1:
The patent implements dynamic temperature control by transitioning from a fixed setpoint to a variable setpoint that changes based on device power consumption and test conditions. The system continuously adjusts the target temperature to match the actual thermal requirements of the IC device during testing, making the control system adaptive rather than static.
Solution Approach 2:
The system changes the temperature setpoint parameter dynamically based on device power measurements and test flow progression. Instead of maintaining a constant temperature, the control system adjusts the target temperature parameter in real-time to accommodate varying thermal management requirements across different test scenarios and device states.
2Adaptability or versatility
If the target temperature is changed dynamically during testing, then diverse test applications are accommodated, but the control system complexity increases
Solution Approach 1:
The system employs feedback mechanisms by continuously monitoring device power consumption and comparing it against expected power profiles. This feedback allows the control system to dynamically adjust temperature setpoints based on actual device behavior rather than following a predetermined schedule, enabling adaptive thermal management for diverse test applications.
Solution Approach 2:
The system performs preliminary actions by pre-calculating or pre-defining temperature profiles based on expected power consumption patterns. Before actual testing begins, the system prepares temperature control strategies that can be executed dynamically, reducing the computational burden during real-time testing while still achieving adaptive control.
3Reliability
If rapid temperature changes are implemented during testing, then device temperature changes are minimized during power transitions, but the thermal control system becomes more complex
Solution Approach 1:
The system implements periodic action by applying frequent, small temperature adjustments rather than single large changes. The control system continuously monitors device power and makes regular updates to the temperature setpoint, creating a series of periodic control actions that maintain temperature stability during dynamic power transitions.
Solution Approach 2:
The system applies beforehand cushioning by anticipating temperature changes based on predicted power consumption patterns. Before significant power transitions occur, the control system pre-adjusts the temperature setpoint to compensate for upcoming thermal changes, cushioning against temperature fluctuations and maintaining device temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and adaptive temperature control, minimizing device temperature fluctuations and supporting various test scenarios, including rapid changes and different target temperatures, thereby enhancing the reliability and effectiveness of IC testing.
Implementation Method 1
a thermal actuator 140 having a conduction surface 142... used to physically heat or cool the temperature of DUT 130
Implementation Method 2
a dynamic thermal controller 255... that controls the thermal actuator 140 using a fast response control loop
Data Source
AI summary
A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.