Dynamic Thermal Management for Multi-Core Processor Hot Spot Reduction

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Solution Overview

Problem

Multi-core processors face challenges in efficiently managing thermal and power dissipation due to non-uniform power density across the die, leading to hot spots and reduced overall power dissipation, which worsens with an increase in core count.

Innovation Solution

Dynamic Thermal Management (DTM) mechanisms dynamically distribute processing power across multiple cores, using a control algorithm to route computational loads from hotter cores to cooler ones, reducing effective power density through thermal capacitance and heat flux density, and adjusting migration frequencies to optimize temperature refund.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multi-core processors are used to improve processing performance, then productivity increases, but temperature and power density increase leading to hot spots

Engineering Contradiction:
Improveprocessing performanceVSAvoiddie temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent implements dynamic thermal management that continuously monitors temperature across processor cores and dynamically migrates computational threads between cores based on real-time thermal conditions. This dynamic approach allows the system to maintain high productivity by keeping cores active while preventing hot spots through adaptive thread migration, thus resolving the contradiction between processing performance and temperature control

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent segments the processor into multiple independent cores with individual temperature monitoring and thread migration capabilities. By dividing the processing workload across segmented cores and selectively migrating threads away from overheating cores, the system maintains overall productivity while managing temperature at the core level, preventing hot spot formation

Inventive Principle:
Principle #1Segmentation

2Productivity

If core count increases to improve processing performance, then productivity increases, but power density and thermal management difficulty increase

Engineering Contradiction:
Improveprocessing performanceVSAvoidthermal management complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent implements a self-regulating thermal management system where the processor automatically monitors its own temperature distribution and performs self-correction through thread migration. This self-service approach reduces thermal management complexity by eliminating the need for external thermal control mechanisms, allowing the multi-core processor to autonomously maintain optimal thermal conditions while preserving processing performance

Inventive Principle:
Principle #25Self-service

3Productivity

If computational load is concentrated on fewer cores to improve efficiency, then productivity increases, but hot spots form reducing reliability

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidthermal reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements a feedback-controlled thermal management system that continuously monitors temperature at each core and uses this feedback to make real-time decisions about thread migration. The system maintains processing efficiency by keeping cores fully utilized while using temperature feedback to redirect threads from hot spots to cooler cores, thus preserving both productivity and thermal reliability simultaneously

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

DTM mechanisms effectively reduce maximum die temperature and power density, improving thermal performance by up to 20-25% and extending battery life, while maintaining high throughput and performance in both scalar and parallel applications.

Implementation Method 1

reducing effective power density through thermal capacitance and heat flux density

Methodology Applied
Scientific EffectThermal capacitance: Heat Sink

Implementation Method 2

reducing effective power density through thermal capacitance and heat flux density

Methodology Applied
Scientific EffectHeat flux: Conduction (thermal)

Data Source

PatentUS10078359B2Method, system, and apparatus for dynamic thermal management
Publication Date: 2018.09.18 TAHOE RES LTD
  • US10078359B2 patent drawing
  • US10078359B2 patent drawing
  • US10078359B2 patent drawing

AI summary

A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to reduce a power density of the multi-core processor for the processing of the computational load.