Dynamic Thermal Margin Control for Semiconductor Processors
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Solution Overview
Problem
Conventional thermal management schemes for semiconductor devices and non-volatile data storage devices face challenges in maintaining performance and reducing heat generation, particularly in mobile devices with limited cooling capabilities, where they often compromise on performance or reliability due to temperature limitations.
Innovation Solution
A dynamic thermal management system that determines a thermal margin based on thread priority and processor load, adjusting voltage and frequency to maintain performance while controlling heat generation, and dynamically manages I/O queues in non-volatile storage devices to prioritize high-priority tasks and operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If voltage and frequency are lowered to control heat generation, then temperature is reduced, but hardware performance deteriorates
Solution Approach 1:
The patent implements dynamic thermal management by continuously monitoring temperature and adjusting voltage/frequency settings in real-time based on thermal conditions and task priorities. The system dynamically switches between performance mode (higher voltage/frequency) and power-saving mode (lower voltage/frequency) to optimize the trade-off between temperature control and hardware performance.
Solution Approach 2:
The system changes operational parameters (voltage and frequency) based on thermal conditions. When temperature exceeds thresholds, the system reduces voltage and frequency to decrease heat generation. When temperature is within acceptable ranges, the system increases voltage and frequency to improve performance, thereby dynamically adjusting parameters to resolve the contradiction.
2Object-generated harmful factors
If voltage and frequency are forced to be lowered for thermal management, then heat generation is reduced, but user experience deteriorates due to performance loss in high-priority tasks
Solution Approach 1:
The patent applies different thermal management strategies to different threads based on their priorities. High-priority threads (affecting user experience) are allowed to run at higher performance levels with relaxed thermal constraints, while low-priority threads are subject to stricter thermal management. This local differentiation resolves the contradiction by protecting user experience while still controlling overall heat generation.
Solution Approach 2:
The system incorporates feedback mechanisms that monitor both temperature and task priority levels. When high-priority tasks are detected, the system adjusts thermal management policies to maintain performance. The feedback loop continuously evaluates whether to enforce thermal constraints or maintain performance based on current operational context, thereby resolving the contradiction between heat control and user experience.
3Reliability
If conventional thermal management is applied to non-volatile storage devices, then thermal safety is improved, but data access performance deteriorates due to restricted I/O operations
Solution Approach 1:
The patent segments I/O queues into different priority levels and applies differentiated thermal management policies to each segment. High-priority I/O operations are allowed to proceed even when thermal constraints are active, while low-priority operations are restricted. This segmentation resolves the contradiction by maintaining thermal safety while preserving critical data access performance.
Solution Approach 2:
The system dynamically adjusts I/O queue management based on real-time thermal conditions and operation priorities. When thermal thresholds are exceeded, the system dynamically restricts low-priority I/O operations while maintaining high-priority access. This dynamic approach resolves the contradiction between thermal safety and data access performance by adapting constraints to current operational needs.
Data Source
AI summary
Disclosed herein are a thermal management apparatus and method using a dynamic thermal margin, and a semiconductor processor device, a non-volatile data storage device and an access control method using the same. The thermal management apparatus and method using a dynamic thermal margin, and the semiconductor processor device, non-volatile data storage device and access control method using the same can guarantee required performance based on importance and priority by scaling a thermal margin based on the importance of a task or the priority of threads, can control the generation of heat in a software manner while being compatible with non-volatile memory interface standards, and can also provide performance varying depending on the importance of a request that is being processed.