Dynamic Thermal Management Using Phase Change Materials

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Solution Overview

Problem

Current thermal management techniques, such as increasing the surface area of heatsinks, often fail to adequately mitigate temperature spikes in devices like semiconductors, leading to instability and the need for thermal throttling, which limits device performance.

Innovation Solution

An apparatus and method utilizing one or more heatsinks, sensors, phase change materials, and processors to dynamically determine whether to store or dissipate heat based on sensor measurements, employing actuators and nanofluids to optimize thermal dissipation and storage, allowing for opportunistic heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the surface area of the heatsink is increased to improve heat dissipation, then the heat dissipation capability is improved, but the device complexity and space requirements increase

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidheatsink structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies dynamics by making the thermal management system adaptive rather than static. Sensors continuously monitor temperature, and the processor dynamically adjusts thermal management strategies in real-time based on current thermal conditions, allowing the system to respond flexibly to changing heat generation patterns without requiring a permanently oversized heatsink.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements preliminary action through thermal throttling, where the processor proactively reduces its performance before temperature reaches critical levels. This preventive approach allows the use of a smaller heatsink by managing heat generation at the source, rather than relying solely on passive heat dissipation infrastructure.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If thermal throttling is used to maintain device stability under heat constraints, then device stability is improved, but productivity and performance are reduced

Engineering Contradiction:
Improvedevice stabilityVSAvoiddevice performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent implements periodic action through dynamic thermal management cycles. Instead of sustained throttling, the system alternates between high-performance operation and brief cooling periods, or between different performance levels, allowing the device to maintain higher average productivity while still managing thermal constraints through rhythmic performance adjustments.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent applies parameter changes by dynamically adjusting multiple operational parameters beyond just performance throttling, including changing which computational tasks are executed, when computations are performed, and resource allocation patterns. This multi-parameter approach maintains device stability while preserving more productivity compared to simple performance throttling.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If aggressive thermal management is implemented to prevent temperature spikes, then temperature control is improved, but device complexity and energy consumption increase

Engineering Contradiction:
Improvetemperature controlVSAvoidenergy consumption for thermal management
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent implements feedback through a closed-loop thermal management system where sensors continuously monitor temperature conditions and feed this information back to the processor. The processor then adjusts its thermal management actions based on this feedback, enabling efficient temperature control by acting only when and where needed rather than through continuous aggressive management.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent applies self-service by enabling the processor to autonomously manage its own thermal conditions through integrated sensing and control capabilities. The processor independently monitors its thermal state and adjusts its operation accordingly, eliminating the need for complex external thermal management hardware and reducing overall system energy consumption.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively mitigates temperature spikes by dynamically controlling thermal dissipation and storage, ensuring device stability and performance while minimizing environmental impact.

Implementation Method 1

one or more phase change materials... In response to a determination to store heat, the one or more processors may be configured to store heat from the one or more processors using the one or more phase change materials

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

one or more heatsinks... In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10750640B2Techniques for mitigating temperature spikes and dissipating heat
Publication Date: 2020.08.18 QUALCOMM INC
  • US10750640B2 patent drawing
  • US10750640B2 patent drawing
  • US10750640B2 patent drawing

AI summary

Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.