Dynamic Thermal Management Using Local and Reference Temperatures
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Solution Overview
Problem
As electronic devices become more integrated and operate at higher speeds, effective thermal management becomes crucial to prevent overheating, which can lead to malfunction, reliability degradation, and user safety issues, as traditional thermal management methods often fail to adapt to abrupt temperature changes and may prioritize performance over stability.
Innovation Solution
A dynamic thermal management method that involves measuring local and reference temperatures, adjusting a target temperature based on thermal coupling, and controlling power output to maintain stable operation, using a temperature management circuit with local and reference temperature sensors and a temperature management unit to dynamically adjust the target temperature and power levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional thermal management methods are used with fixed target temperature, then device performance is maintained, but the device cannot adapt to abrupt temperature changes and may overheat
Solution Approach 1:
The patent applies dynamics by transitioning from a fixed target temperature to a dynamic target temperature that adapts to changing thermal conditions. The temperature management circuit continuously monitors local temperature and adjusts the target temperature accordingly, enabling the system to respond to abrupt temperature changes while maintaining stability through controlled adaptation.
Solution Approach 2:
The patent implements feedback by using a temperature management circuit that continuously measures local temperature and uses this information to adjust the target temperature. This closed-loop feedback mechanism enables the system to adapt to temperature changes while maintaining reliable operation through continuous monitoring and adjustment.
2Productivity
If target temperature is set high to secure performance, then productivity is improved, but thermal stability and safety are compromised
Solution Approach 1:
The patent uses dynamics to adjust the target temperature based on real-time local temperature conditions. When local temperature is low, the target temperature is set high to maximize performance. When local temperature increases, the target temperature is reduced to prevent overheating. This dynamic adjustment resolves the contradiction between productivity and safety.
Solution Approach 2:
The patent applies parameter changes by modifying the target temperature parameter according to local temperature conditions. The temperature management circuit changes the target temperature parameter dynamically based on measurements from the temperature sensor, allowing the system to optimize performance when safe and prevent overheating when necessary.
3Reliability
If target temperature is set low to ensure stability, then reliability is improved, but device performance is reduced
Solution Approach 1:
The patent applies dynamics by making the target temperature adaptive rather than fixed. The system maintains high target temperatures when local conditions allow (preserving performance) and reduces target temperatures only when necessary (maintaining stability). This dynamic approach resolves the contradiction by applying conservative limits only when needed.
Solution Approach 2:
The patent uses parameter changes to adjust the target temperature based on local temperature measurements. When local temperature is low, the target temperature parameter is set high for performance. When local temperature rises, the parameter is changed to a lower value for stability. This selective parameter adjustment resolves the contradiction between reliability and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach efficiently manages thermal conditions by setting a high target temperature for performance when local temperatures are low and a low target temperature for stability when high, preventing overheating and ensuring stable operation while optimizing performance.
Implementation Method 1
providing a local temperature measurement by measuring a temperature of a local spot in the electronic device
Implementation Method 2
providing a reference temperature measurement by measuring a temperature of a reference spot in the electronic device, the reference spot being thermally coupled to the local spot
Implementation Method 3
the reference spot being thermally coupled to the local spot
Data Source
AI summary
To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.