Dynamic Time Warping for Substrate Processing Data Analysis
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Solution Overview
Problem
In substrate processing apparatuses, individual differences due to variations in parts, assembly, and sensor deterioration lead to non-uniformity in wafer processing results, necessitating effective analysis methods to minimize these differences.
Innovation Solution
An information processing apparatus utilizing dynamic time warping to analyze similarity and digitize differences in time-series data from multiple substrate processing apparatuses, enabling the identification of individual differences and improving operational consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If dynamic time warping is used to analyze similarity between time-series data pieces, then measurement precision of individual differences is improved, but device complexity increases
Solution Approach 1:
The patent introduces an information processing apparatus as an intermediary system that performs dynamic time warping analysis between substrate processing apparatuses. This mediator computes similarity metrics and generates analysis results, allowing precise measurement of individual differences without requiring complex modifications to the substrate processing apparatuses themselves. The intermediary handles the computational complexity while keeping the production system relatively simple.
2Manufacturing precision
If time-series data analysis is performed on multiple substrate processing apparatuses, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The system performs preliminary analysis by acquiring time-series data pieces from substrate processing apparatuses and computing similarity metrics in advance. By pre-processing the data and establishing baseline comparisons before actual production issues arise, the system can quickly identify deviations without requiring time-consuming analysis during critical production periods. This preliminary action enables faster response to manufacturing variations.
3Reliability
If individual differences among substrate processing apparatuses are analyzed, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex physical measurement and comparison systems with information processing and data analysis. Instead of using complex mechanical sensors and direct physical comparisons between apparatuses, the system uses dynamic time warping algorithms to analyze time-series data patterns. This substitution of mechanical/physical systems with computational methods achieves reliable individual difference analysis while avoiding the complexity of direct physical comparison systems.
Data Source
AI summary
An information processing apparatus includes: a time-series data acquisition unit that acquires a plurality of time-series data pieces output from one or more substrate processing apparatuses; an analysis unit that analyzes similarity between the time-series data pieces acquired from the substrate processing apparatuses that are performing a processing according to the same sequence, by using dynamic time warping, thereby digitizing a difference between the time-series data pieces; and an output control unit that outputs an analysis result based on the difference between the time-series data pieces.