Dynamic Transfer Scheduling for Semiconductor Substrate Processing
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Solution Overview
Problem
Current substrate processing apparatuses face inefficiencies in scheduling transfer cycles and stay times for wafers across multiple processing modules, leading to reduced throughput and increased operational complexity in semiconductor manufacturing.
Innovation Solution
A substrate processing apparatus with a controller that determines the number of transfer destinations and stay cycles for wafers based on processing time, cycle time, and the number of usable modules, optimizing the transfer schedule to minimize wait times and maximize throughput by adjusting the transfer order and frequency across modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transfer schedule is used in substrate processing apparatus, then the apparatus can operate with a fixed transfer cycle, but the throughput is reduced and wait times increase due to inefficient utilization of multiple processing modules
Solution Approach 1:
The transfer schedule is made dynamic by allowing the number of stay cycles to vary based on real-time module availability and processing status. The controller adjusts transfer destinations and stay cycle counts dynamically rather than using fixed predetermined schedules, enabling the system to adapt to changing conditions and optimize throughput continuously.
Solution Approach 2:
The system changes the parameter of stay cycle count based on module usability. When modules become unusable or require maintenance, the controller modifies the number of stay cycles accordingly. This parameter adjustment allows the system to maintain optimal throughput even when processing capacity changes, preventing bottlenecks and reducing wait times.
2Productivity
If the number of stay cycles is increased to maximize module utilization, then module capacity is better utilized, but the transfer schedule complexity increases and difficulty in determining optimal transfer destinations arises
Solution Approach 1:
The controller implements feedback mechanisms by continuously monitoring module processing status and usability. This feedback allows the system to automatically adjust transfer schedules and stay cycle counts without manual intervention. The feedback loop simplifies complexity by replacing complex manual scheduling with automated real-time adjustments based on actual system state.
Solution Approach 2:
The transfer scheduling system performs self-service by automatically determining optimal transfer destinations and stay cycle counts based on current module availability. The controller autonomously manages the complexity of scheduling multiple wafers across multiple modules without requiring external coordination, reducing the perceived complexity for operators while maintaining high utilization.
3Productivity
If modules are operated in parallel to increase throughput, then more wafers can be processed simultaneously, but coordination complexity increases and transfer timing becomes more difficult to manage
Solution Approach 1:
The controller serves multiple functions simultaneously: it manages parallel module operations, determines transfer destinations, calculates stay cycle counts, and monitors module usability. This universal control mechanism simplifies coordination by consolidating multiple control functions into a single intelligent system that handles parallel operations seamlessly without requiring separate coordination mechanisms for each module.
Data Source
AI summary
A substrate processing apparatus includes: a processing block in which a substrate is sequentially transferred and processed; a carry-in/out transfer mechanism that carrys-in/out the substrate with respect to modules; a carry-out module configured to place the substrate therein after the substrate is processed; a multi-module configured by a plurality of modules having a same order in which the substrate is transferred in the processing block; a main transfer mechanism that moves around in a transfer path provided in the processing block to deliver the substrate among the modules; and a controller that sets a first transfer schedule including determination of a number of modules to become transfer destinations of the substrate in the multi-module, and determination of a number of stay cycles which is a number of times that the main transfer mechanism moves around after the substrate is carried into the multi-module until the substrate is carried out.