Dynamic Voltage Scaling for Thermal Mitigation in Multi-PU Devices

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Solution Overview

Problem

Mobile devices with multiple processing units face challenges in thermal mitigation, as existing methods require multiple power supplies, leading to increased cost and die area, while also impacting performance and user safety due to excessive heat generation.

Innovation Solution

A new architecture that connects all processing units to a single power supply, with a secondary power supply derived from the first, allowing for selective disconnection of non-real-time units and voltage reduction to manage heat without significant performance impact, using a feedback loop for temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple independent power supplies are used to supply different voltages to different processing units, then thermal mitigation performance is improved, but device cost and die area increase

Engineering Contradiction:
Improveprocessing unit temperatureVSAvoidpower supply die area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent merges multiple power supply functions into a single power supply unit. This single power supply can dynamically adjust voltage levels to different processing units through voltage regulation circuits, eliminating the need for multiple separate power supply components and reducing die area while maintaining the ability to perform thermal mitigation on individual processing units

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single power supply is designed with multi-functional capability to serve multiple processing units with different voltage requirements. It includes voltage regulation circuits that can independently control output voltage to different processing units, making one power supply unit perform the function of multiple dedicated power supplies

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If voltage is reduced to processing units for thermal mitigation, then heat generation is reduced, but processing performance decreases

Engineering Contradiction:
Improveprocessing unit temperatureVSAvoidprocessing unit performance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent implements dynamic voltage scaling that adjusts voltage levels in real-time based on thermal conditions and workload requirements. When thermal mitigation is needed, voltage is reduced to lower heat generation. When performance is required, voltage is increased to boost processing speed, creating a dynamic balance between temperature control and performance maintenance

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes voltage parameters dynamically based on operational conditions. The power supply can adjust output voltage levels to match the instantaneous needs of processing units, lowering voltage when cooling is needed and raising voltage when performance is prioritized, thereby resolving the contradiction between thermal control and performance

Inventive Principle:
Principle #35Parameter changes

3Temperature

If multiple power supplies are used to independently control processing units, then thermal control precision is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoidpower supply architecture complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent introduces voltage regulation circuits as intermediary components between the single power supply and processing units. These regulation circuits act as mediators that can independently adjust voltage levels for different processing units, providing precise thermal control without requiring multiple independent power supplies, thus reducing overall system complexity

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11340689B2Thermal mitigation in devices with multiple processing units
Publication Date: 2022.05.24 QUALCOMM INC
  • US11340689B2 patent drawing
  • US11340689B2 patent drawing
  • US11340689B2 patent drawing

AI summary

A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, including connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply, and performing thermal mitigation. Performing thermal mitigation includes disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU, and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply.