E-beam Tape Manufacturing System for HTS Conductors

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Solution Overview

Problem

Current tape-manufacturing systems for high-temperature superconductor (HTS) conductors face limitations in production throughput due to small ion beam sputter source sizes and low deposition rates, as well as the finite lifetime of thermionic filaments in electron beam systems, leading to interruptions in continuous production.

Innovation Solution

A tape-manufacturing system utilizing multiple electron beam deposition sources, each capable of in-process repair, with an assist source and a controller to maintain a uniform coating profile over long substrates, allowing for continuous operation and increased deposition rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If ion beam sputtering sources are used for deposition, then coating can be applied to HTS conductors, but deposition rates are limited to about 1 angstrom per second and source size is limited to about 0.6 m

Engineering Contradiction:

Improvedeposition rateVSAvoidsource size limitation

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces the ion beam sputtering system with an electron beam evaporation system. This substitution enables significantly higher deposition rates (greater than 1 angstrom per second) while allowing for larger source sizes capable of coating long substrates, thereby resolving the productivity and device complexity contradiction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If a single e-beam deposition source is used, then deposition can be performed, but the thermionic filament has a finite lifetime leading to production interruptions

Engineering Contradiction:

Improvecontinuous production capabilityVSAvoidfilament lifetime

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent implements multiple e-beam deposition sources with redundant filaments within each source. When one filament fails, another can take over, ensuring continuous operation. This local redundancy approach maintains high productivity while compensating for the finite lifetime of individual filaments.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The system includes备用 (spare) filaments that are prepared in advance within each e-beam source. When a filament approaches end-of-life or fails, the system can switch to a备用 filament without interrupting production, thus cushioning against potential downtime and maintaining reliability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Length of moving object

If traditional IBAD systems are used for HTS conductor manufacturing, then biaxial texture can be imparted to the template layer, but the small source size requires long production runs to manufacture meters to hundreds of kilometers of conductor

Engineering Contradiction:

Improveconductor lengthVSAvoidproduction run time

Core Design Contradiction:

Length of moving objectVSLoss of time

Solution Approach 1:

The patent replaces the ion beam sputtering system with electron beam evaporation, which provides higher deposition rates. This substitution dramatically reduces the time required to deposit coatings on long substrates, enabling the manufacturing of meters to hundreds of kilometers of conductor in practical production timeframes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system employs multiple e-beam sources that can be independently controlled and positioned along the substrate length. This dynamic arrangement allows the system to efficiently coat very long substrates by distributing the deposition task across multiple sources, reducing the total production time compared to a single small source.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables continuous, high-throughput coating of long HTS conductor substrates with minimal interruptions, achieving deposition rates greater than 1 angstrom per second and maintaining coating integrity over extended lengths.

Implementation Method 1

Each e-beam deposition source is capable of communicating an evaporant material with at least a portion of at least one tape substrate to deposit a coating thereon

Methodology Applied

Scientific EffectElectron beam vaporization: Electron Beam

Implementation Method 2

an electron beam (e-beam) to vaporize an evaporant material

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

the at least one assist source is capable of communicating a beam of a species to the coating

Methodology Applied

Scientific EffectIon beam bombardment: Ion Beam

Data Source

PatentUS7914848B2Tape-manufacturing system having extended operational capabilities

Publication Date: 2011.03.29 SUPERPOWER INC

AI summary

A tape-manufacturing system for coating at least one tape substrate such as, for example, for the manufacture of a high-temperature superconductor (HTS) conductor is disclosed. The tape-manufacturing system includes at least two electron beam (e-beam) deposition sources, at least one assist source and, optionally, a controller. Each e-beam deposition source may be in-process repairable. Each e-beam deposition source is capable of communicating an evaporant material with at least a portion of at least one tape substrate to deposit a coating thereon. The at least one assist source is capable of communicating a beam of a species to the coating. The controller communicates with the at least two e-beam deposition sources and the at least one assist source.