Integrated E-Machine Controller Thermal Path Design
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Solution Overview
Problem
Conventional controllers for turbomachines are bulky, generate significant heat, and are inefficiently manufactured, making them unsuitable for high-temperature and vibrational environments, and difficult to assemble.
Innovation Solution
An integrated e-machine controller with a coolant core and bus bar that defines a thermal path for heat transfer from semiconductor circuit components to the coolant core, providing effective cooling and compact packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If conventional controllers are used, then control function is provided, but the controller is heavy and bulky
Solution Approach 1:
The patent merges the controller housing with the coolant core into a single integrated component. The housing serves dual functions as both structural enclosure and thermal management system, eliminating the need for separate cooling components and reducing overall weight and complexity
Solution Approach 2:
The controller housing is designed to perform multiple functions simultaneously: structural support, electrical insulation, and heat dissipation. The coolant core integrated into the housing provides thermal management while the housing itself provides mechanical protection, creating a multi-functional component that reduces overall system complexity
2Temperature
If conventional controllers are used, then control function is provided, but significant heat is generated that negatively affects operations
Solution Approach 1:
The patent extracts the heat management function from the overall controller design by implementing a dedicated coolant core that actively removes heat from the semiconductor components. This separation allows the control electronics to be thermally isolated from the heat-generating components while maintaining functional integration
Solution Approach 2:
The coolant core acts as an intermediary thermal management system between the heat-generating semiconductor components and the external environment. It provides a controlled thermal pathway that efficiently transfers heat away from sensitive components while maintaining operational temperatures within acceptable ranges
3Ease of manufacture
If conventional controllers are used, then control function is provided, but manufacture and assembly are difficult and time consuming
Solution Approach 1:
By combining the housing and coolant core into a single molded component, the patent reduces the number of manufacturing steps and assembly operations required. The integrated design allows for one-step fabrication rather than multi-step assembly, significantly improving manufacturing efficiency and reducing production time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a robust, compact, and efficiently operating controller that maintains acceptable temperatures across extreme conditions, enhancing manufacturing efficiency and operational longevity.
Implementation Method 1
The bus bar is thermally coupled to the semiconductor circuit component to receive heat from the semiconductor circuit component and to define a thermal path from the semiconductor circuit component, through the bus bar, and to the coolant core
Implementation Method 2
The controller includes a coolant core with a first seat and a second seat thereon. The semiconductor circuit component is thermally coupled to the coolant core to be cooled thereby
Data Source
AI summary
A controller for an e-machine of a turbomachine includes a coolant core with a first seat and a second seat thereon. The controller includes a semiconductor circuit component that is seated on the first seat and that is thermally coupled to the coolant core to be cooled thereby. The controller also includes a bus bar that is seated on the second seat and that is thermally coupled to the coolant core to be cooled thereby. The bus bar is thermally coupled to the semiconductor circuit component to receive heat from the semiconductor circuit component and to define a thermal path from the semiconductor circuit component, through the bus bar, and to the coolant core.