EAMR Head Wafer Packaging for Heat Dissipation
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Solution Overview
Problem
Conventional energy-assisted magnetic recording (EAMR) disk drives face challenges in heat dissipation due to thermally insulating components and the need for smaller sizes and thinner track widths, making fabrication and performance difficult.
Innovation Solution
A method where a plurality of lasers are bonded to a first substrate with high thermal conductivity, and EAMR transducers are fabricated on a second substrate, with the substrates bonded such that the lasers and transducers reside between them, allowing for improved heat dissipation and thinner write poles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional laser diodes are mounted on the trailing edge of the slider, then the EAMR transducer can function, but heat dissipation becomes problematic due to thermally insulating components
Solution Approach 1:
A thermally conductive substrate is introduced as an intermediary between the laser diode and the EAMR transducer. This substrate acts as a thermal pathway, conducting heat away from the laser diode and transducer assembly, thereby resolving the heat dissipation problem without requiring changes to the fundamental device structure or fabrication process
Solution Approach 2:
The patent replaces the conventional approach of mounting the laser diode directly on the slider with a substrate-based mounting system. This substitution allows for improved thermal management by using the substrate as a heat sink and thermal conduction path, eliminating the heat dissipation issues associated with direct mounting on thermally insulating slider components
2Manufacturing precision
If the drive size is reduced and track widths are thinned, then higher recording densities are achieved, but fabrication becomes increasingly challenging
Solution Approach 1:
The fabrication process is segmented into separate stages: first fabricating the EAMR transducer array on a substrate, then bonding the laser diode array to the substrate, and finally separating the substrate into individual heads. This segmentation allows each stage to be optimized independently, improving manufacturing precision for small features while maintaining fabrication efficiency through parallel processing of multiple heads
Solution Approach 2:
The EAMR transducer array is fabricated on the substrate in advance, before the laser diodes are mounted. This preliminary action allows the transducer features to be created with high precision using standard fabrication techniques, while the subsequent laser mounting and head separation steps can be performed more efficiently without compromising the precision of the small-scale transducer features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation without adding magnetic structures, facilitates the fabrication of thinner write poles, and improves the performance of EAMR heads by allowing for better thermal management and more efficient energy transfer.
Implementation Method 1
Light from the laser diode 30 coupled into the grating is then provided to a waveguide (not shown). The waveguide directs the light toward the conventional media 12, heating a small region of the conventional media 12.
Implementation Method 2
A plurality of lasers are bonded to a first substrate with high thermal conductivity
Data Source
AI summary
A method for providing energy assisted magnetic recording (EAMR) heads is described. The method comprises bonding a plurality of lasers to a first substrate. The plurality of lasers corresponds to the plurality of EAMR heads and is for providing energy to a plurality of EAMR transducers. The method further comprises fabricating the plurality of EAMR transducers for the plurality of EAMR heads on a second substrate, bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate, removing at least one of the first substrate and the second substrate, and separating a remaining substrate into the plurality of EAMR heads.