EAMR Head Laser Coupling via Substrate Apertures
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Solution Overview
Problem
Conventional energy assisted magnetic recording (EAMR) disk drives face challenges in manufacturability and performance, particularly in coupling lasers with EAMR transducers and assembling sliders and suspensions effectively.
Innovation Solution
A method and system that utilize a substrate with apertures for transmitting optical energy, where EAMR transducers are fabricated on the front side and lasers are coupled to the back side, allowing light to be directed through these apertures to the transducers, with electrical insulation and alignment techniques to improve assembly and alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the laser diode is mounted in proximity to the trailing face of the slider, then the assembly process is simplified, but the alignment precision between the laser and EAMR transducer deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-forming alignment features (such as alignment holes or registration marks) on the substrate before mounting the laser diode and EAMR transducer. This allows the components to be automatically aligned during assembly, maintaining high alignment precision while simplifying the manufacturing process. The alignment features are created during substrate fabrication, so no additional alignment steps are needed during laser mounting.
Solution Approach 2:
The patent replaces manual or mechanical alignment methods with optical or electromagnetic alignment techniques. For example, the substrate may include alignment holes that allow light or electrical signals to pass through, enabling precise alignment of the laser diode with the EAMR transducer without physical contact or complex mechanical adjustment mechanisms.
2Productivity
If multiple transducers are fabricated in parallel on the same substrate, then the productivity increases, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate into multiple independent regions, each containing an EAMR transducer and its associated laser diode. Each region can be independently fabricated, tested, and activated. This modular approach allows parallel fabrication of multiple transducers while maintaining manageable complexity through clear spatial separation and standardized interconnection structures.
Solution Approach 2:
The patent implements universality by designing a standardized substrate architecture that can accommodate multiple types of transducers and laser configurations. The substrate includes universal alignment features, electrical connection patterns, and mechanical mounting structures that work across all transducer positions, reducing overall system complexity despite the increased number of components.
3Temperature
If the laser is mounted on the back side of the substrate, then the thermal management is improved, but the real estate for electronics on the front side is reduced
Solution Approach 1:
The patent applies dimensionality change by utilizing the third dimension (vertical depth) of the substrate for laser mounting and thermal management functions. The laser diode is mounted on the back side of the substrate, and heat sinks or thermal vias extend through the substrate thickness to dissipate heat. This vertical arrangement frees up the front surface area for electronic components while maintaining effective thermal management through the substrate's internal structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the manufacturability and performance of EAMR heads by allowing for improved thermal management, increased real estate for electronics, and more precise alignment, reducing costs and improving throughput through wafer-level processing.
Implementation Method 1
The aperture is a through-hole between the back side and the front side of the substrate... The lasers are configured to provide light through the apertures to the EAMR transducers
Implementation Method 2
Light from the laser diode 30 is provided substantially along the optic axis 32 of the conventional laser diode 30 to the trailing face 26 of the slider 20... The light from the laser diode 30 coupled into the grating is then provided to a waveguide (not shown). The waveguide directs the light toward the conventional EAMR media 12, heating a small region of the conventional EAMR media 12
Data Source
AI summary
A system for providing energy assisted magnetic recording (EAMR) heads using a substrate is described. The substrate has front and back sides and apertures therein. The apertures are through-holes between the front and back sides of the substrate. The system includes providing a transmission medium in the apertures and fabricating EAMR transducers on the front side of the substrate. The EAMR transducers correspond to the apertures and the EAMR heads. The system also includes electrically insulating the back side of the substrate. The back side of the substrate is also prepared for mounting of the lasers. The lasers then are coupled the back side of the substrate. The lasers correspond to the EAMR heads and are configured to provide light through the apertures to the EAMR transducers. The system also includes separating the substrate into the EAMR heads.