Laser-Integrated EAMR Slider Thermal Management

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Solution Overview

Problem

Conventional energy-assisted magnetic recording (EAMR) disk drives face challenges in integrating a laser diode without increasing the fly height of the transducer and in effectively dissipating the heat generated by the laser diode, which can affect the performance and reliability of the drive.

Innovation Solution

The integration of a laser within the EAMR disk drive is achieved by using a substrate with an overcoat layer and device layer, where the laser is thermally coupled to the substrate through high thermal conductivity contacts that also provide electrical insulation, and an optional heat spreader is used to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the laser diode is physically integrated onto the slider, then the fly height can be maintained, but the back side and trailing edge of the slider become crowded

Engineering Contradiction:
Improveheat dissipationVSAvoidslider structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the laser diode onto the trailing edge of the slider by utilizing the vertical dimension and routing light through the slider thickness to reach the media. This dimensional approach allows the laser to be positioned on the trailing edge while still effectively heating the recording region, resolving the spatial crowding issue on the slider surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The slider structure is designed to serve multiple functions: it supports the transducer for reading/writing, provides a mounting surface for the laser diode on its trailing edge, and acts as a light guide to transmit laser energy to the recording media. This multi-functionality reduces the need for separate components and simplifies the overall system structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If the laser diode is integrated onto the slider, then the structure is compact, but heat generated by the laser diode affects performance and reliability

Engineering Contradiction:
Improveintegration levelVSAvoidlaser diode heat generation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the laser diode package by providing a dedicated heat sink structure that is thermally coupled to the laser diode. This heat sink is thermally connected to the slider substrate, which acts as a heat spreader, effectively removing heat from the laser diode to maintain its performance and reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The slider substrate serves as an intermediary thermal path between the laser diode and the surrounding environment. The substrate conducts heat away from the laser diode mounting region and distributes it over a larger area, preventing localized overheating while maintaining the compact integrated structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional laser mounting is used, then the laser can be attached to the slider, but the fly height is affected and fabrication is complicated

Engineering Contradiction:
Improvefabrication simplicityVSAvoidheat management
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent merges the laser mounting structure with the slider substrate by providing a mounting surface that is an integral part of the slider. The laser diode is mounted directly on this surface, and the substrate itself serves as the thermal management pathway, eliminating the need for separate mounting brackets or heat sink assemblies that would complicate fabrication.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for improved thermal management of the EAMR disk drive, maintaining the fly height and enhancing the reliability and performance by effectively dissipating heat generated by the laser diode without complicating the fabrication or increasing the physical footprint.

Implementation Method 1

Light from the laser diode 30 is provided substantially along the optic axis 32 of the conventional laser diode 30 to the trailing edge 26 of the slider 20... The light from the laser diode 30 coupled into the grating is then provided to a waveguide (not shown). The waveguide directs the light toward the conventional media 12, heating a small region of the conventional media 12.

Methodology Applied
Scientific EffectLight absorption and heating: Absorption (EM radiation)

Implementation Method 2

The contacts provide thermal connection through the overcoat layer and the device layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9245543B1Method for providing an energy assisted magnetic recording head having a laser integrally mounted to the slider
Publication Date: 2016.01.26 WESTERN DIGITAL TECHNOLOGIES INC
  • US9245543B1 patent drawing
  • US9245543B1 patent drawing
  • US9245543B1 patent drawing

AI summary

A method for providing energy assisted magnetic recording (EAMR) heads are described. The method and system include providing a substrate, at least one EAMR transducer, an overcoat layer and at least one laser. The substrate has a leading edge and a substrate trailing edge. The EAMR transducer(s) reside in a device layer and on the substrate trailing edge. The overcoat layer includes a plurality of contacts. The device layer is between the overcoat layer and the substrate trailing edge. The laser(s) provide energy to the EAMR transducer. The overcoat layer is between the substrate trailing edge and the laser(s). The laser(s) are electrically coupled to at least a first portion of the contacts. The contacts provide thermal connection through the overcoat layer and through the device layer to the substrate. At least a second portion of the contacts is electrically insulated from the substrate.