Ear Hook Headphone Dual-Layer PCB Layout for Circuit Expansion
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Solution Overview
Problem
Ear hook headphones face a challenge in integrating more circuits within a limited device space without increasing volume or weight, which affects wearing comfort and stability.
Innovation Solution
A dual-layer circuit board structure is implemented, utilizing vertical space within the circuit board compartment by arranging two circuit boards perpendicular to the surface of the first circuit board, connected via connectors, and incorporating a signal shielding component and conductive buffer pad to manage electromagnetic interference and enhance electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circuit expansion is achieved through hardware circuits, then functional demands are met, but circuit area increases and device volume increases
Solution Approach 1:
The patent transitions from a single-layer circuit board to a dual-layer circuit board structure, utilizing the vertical dimension (z-axis) by stacking two circuit boards. This allows circuit expansion without increasing the horizontal footprint (x-y plane), thereby meeting functional demands while controlling device volume.
2Adaptability or versatility
If circuit expansion is achieved through hardware circuits, then functional demands are met, but circuit area increases and device weight increases
Solution Approach 1:
By stacking circuit boards vertically, the patent achieves circuit expansion without proportionally increasing device weight. The dual-layer structure allows more circuits to be packed into the same volume, improving functional density while controlling weight increase.
3Area of stationary object
If dual-layer circuit board structure is implemented, then circuit area is expanded within limited space, but device complexity increases
Solution Approach 1:
The patent divides the circuit board into two separate layers, each potentially serving different functional purposes. This segmentation allows independent design and optimization of each layer, managing complexity by breaking down the overall circuit design into manageable sections.
Solution Approach 2:
The dual-layer circuit board structure nests one circuit board within the same housing space as another, utilizing vertical stacking. This nesting approach maximizes space utilization while maintaining a compact form factor, expanding circuit area without increasing external dimensions.
4Area of stationary object
If dual-layer circuit board structure is implemented, then circuit area is expanded, but electromagnetic interference increases
Solution Approach 1:
The patent introduces shielding components that convert the harmful electromagnetic interference into a manageable issue. The shielding components are strategically placed between or around circuit board layers to block and redirect electromagnetic signals, transforming the potential harm into a controlled environmental factor.
Data Source
AI summary
The present disclosure provides a headphone, the headphone is provided with a dual-layer circuit board structure within the circuit board compartment, so that the vertical space of the circuit board compartment perpendicular to the first circuit board surface is fully utilized, thereby meeting more circuit expansion requirements without expanding the circuit board compartment, such as requirements for storage and playback of audio data. Furthermore, the headphone provided by the present disclosure can use other models of headphone housing, without the need to redesign and re-mold, thereby reducing development and production costs.