Earloop Microphone Spatial Arrangement for Headset Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current earbuds face challenges in reducing size and weight while enhancing the transmission and reception characteristics of sound and electromagnetic signals.
Innovation Solution
The use of an earloop microphone with increased spacing between microphones to create phase and amplitude differences, allowing for sound source identification and amplification through algorithms, and the integration of an antenna in the earloop for improved communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the spacing between microphones is increased to create phase and amplitude differences for sound source identification, then the transmission and reception characteristics of sound signals are enhanced, but the size of the headset increases
Solution Approach 1:
The patent places one microphone in the earloop (wrapping around the ear) and other microphones in the housing, utilizing the third dimension (spatial arrangement around the ear) rather than simply increasing linear distance. This creates sufficient phase and amplitude differences for accurate sound source identification while maintaining a compact overall headset size.
2Reliability
If multiple microphones with increased spacing are used to enhance sound signal reception, then the transmission and reception characteristics are improved, but the weight of the headset increases
Solution Approach 1:
By distributing microphones across different spatial locations including the earloop and housing in three-dimensional space, the patent achieves reliable sound signal reception with enhanced phase and amplitude differences without requiring excessive linear spacing that would increase weight.
Solution Approach 2:
The earloop microphone is strategically positioned to capture sound from a specific direction (around the ear), while other microphones in the housing capture sounds from different angles. This localized positioning optimizes signal reception quality for voice calls without adding unnecessary weight throughout the entire headset.
3Volume of moving object
If microphones are placed closer together to reduce headset size, then the size and weight are reduced, but the phase and amplitude differences necessary for sound source identification are diminished
Solution Approach 1:
The patent overcomes the limitation of close microphone spacing by utilizing three-dimensional spatial arrangement. The earloop microphone wrapped around the ear creates effective spatial separation from housing microphones, generating sufficient phase and amplitude differences for accurate sound source identification even when overall headset dimensions are minimized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size and weight of earbuds while enhancing signal transmission and reception, enabling effective sound source identification and amplification, and supports interactive voice communication.
Implementation Method 1
The first spacing creates first phase and amplitude differences between the second audio signal and the first audio signal
Implementation Method 2
The first spacing creates first phase and amplitude differences between the second audio signal and the first audio signal
Implementation Method 3
The second spacing creates second phase and amplitude differences between the third audio signal and the first audio signal
Implementation Method 4
The second spacing creates second phase and amplitude differences between the third audio signal and the first audio signal
Implementation Method 5
A gain is applied to amplify the source signal
Data Source
AI summary
A headset implements an earloop microphone and includes a housing. An earloop of the headset secures the headset to an ear of a user. A first microphone is acoustically coupled to a first opening in the housing. A second microphone is acoustically coupled to a second opening in the housing. A third microphone is acoustically coupled to a third opening in the earloop.