Waterproof Earphone Acoustic Module for Sensitivity Consistency

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Solution Overview

Problem

Existing technologies fail to effectively address the issues of moisture-proof and liquid-proofing in the field of electronic devices, particularly in earphones, leading to sensitivity deviations among acoustic sensors and low yield rates due to moisture and liquid ingress, making it difficult to adjust sensitivity and ensure consistency across earphones.

Innovation Solution

The earphone incorporates a waterproof acoustic module with a housing and accommodation cavities, featuring sound transmission holes and waterproof assemblies to prevent liquid ingress, allowing for pre-adjusted acoustic modules to ensure sensitivity consistency and high yield rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If acoustic sensors are sealed and installed using a waterproof structure to meet moisture-proof and liquid-proof requirements, then waterproof performance is improved, but sensitivity adjustment becomes difficult and sensitivity deviation increases

Engineering Contradiction:
Improvewaterproof performanceVSAvoidsensitivity consistency
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The acoustic module is divided into separate functional components: the acoustic sensor, the circuit board, and the waterproof housing. This segmentation allows the sensor to be pre-assembled and tested for sensitivity before final waterproof assembly, enabling sensitivity adjustment without compromising the waterproof seal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The acoustic sensor is pre-assembled with its circuit board and tested for sensitivity before being integrated into the waterproof housing. This preliminary assembly and testing step allows sensitivity to be adjusted and standardized before the final waterproof sealing is applied, ensuring consistency across all units.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If acoustic sensors are sealed within the waterproof structure, then moisture-proof performance is improved, but disassembly and adjustment become difficult

Engineering Contradiction:
Improvemoisture-proof performanceVSAvoidsensor adjustability
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The acoustic module uses a segmented design where the sensor assembly can be separated from the waterproof housing through the opening. This allows the sensor to be accessed for adjustment or replacement while maintaining the waterproof integrity of the main housing during normal operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The circuit board serves as an intermediary component that connects the acoustic sensor to the external world through the opening in the waterproof housing. This intermediary structure allows electrical connections and sensitivity adjustments to be made without compromising the waterproof seal of the main housing.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If acoustic sensors are assembled with waterproof structures, then liquid-proof performance is improved, but sensitivity deviation among batch products increases

Engineering Contradiction:
Improveliquid-proof performanceVSAvoidyield rate
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The acoustic sensors are pre-assembled, tested, and sorted by sensitivity before being integrated into the waterproof housing. This preliminary standardization step ensures that only sensors meeting specific sensitivity criteria are used, reducing sensitivity deviation in the final batch products and improving yield rate.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention implements parameter control by establishing specific sensitivity ranges and tolerance limits for the acoustic sensors during the pre-assembly stage. By controlling the sensitivity parameter before final assembly, the variation among batch products is reduced, thereby improving the yield rate.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260113566A1earphones
Publication Date: 2026.04.23 SHENZHEN SHOKZ CO LTD
  • US20260113566A1 patent drawing
  • US20260113566A1 patent drawing
  • US20260113566A1 patent drawing

AI summary

The present disclosure provides an earphone. The earphone comprises a housing and at least one waterproof acoustic module. At least one accommodation cavity and at least one sound transmission hole are formed on an inner wall of the housing. The at least one sound transmission hole penetrates through the housing and communicates with the at least one accommodation cavity. Each of the at least one waterproof acoustic module comprises a communication hole and a waterproof assembly. The waterproof assembly is configured to prevent a liquid from entering an interior of the waterproof acoustic module through the communication hole. The at least one waterproof acoustic module is disposed in the at least one accommodation cavity and covers the at least one sound transmission hole to prevent the liquid from entering an internal space of the housing through the at least one sound transmission hole.