Dual-Speaker Earphone Cavity Layout for Better Sound Isolation
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Solution Overview
Problem
The small internal space and limited weight of earphones result in a small acoustic cavity volume for speaker assemblies, leading to unsatisfactory sound quality.
Innovation Solution
A speaker assembly design featuring a housing assembly with separate accommodating cavities for bone-conduction and air-conduction speakers, where the bone-conduction speaker blocks a communication hole to isolate cavities and includes pressure relief holes, enhancing the acoustic cavity volume and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the internal space of earphones is kept small to maintain portability, then the weight and size are reduced, but the volume of the acoustic cavity is limited which deteriorates sound quality
Solution Approach 1:
The housing assembly is divided into multiple accommodating cavities (first accommodating cavity for bone-conduction speaker, second accommodating cavity for air-conduction speaker) separated by partition walls. This segmentation allows each cavity to be optimized for its specific speaker type while collectively maximizing the total acoustic volume within the constrained earphone housing, thereby improving sound quality without increasing overall device size or weight
2Volume of moving object
If bone-conduction speaker and air-conduction speaker share the same cavity, then space is utilized efficiently, but interference between the two speakers deteriorates sound quality
Solution Approach 1:
The housing assembly is divided into multiple accommodating cavities (first accommodating cavity for bone-conduction speaker, second accommodating cavity for air-conduction speaker) separated by partition walls. This segmentation allows each cavity to be optimized for its specific speaker type while collectively maximizing the total acoustic volume within the constrained earphone housing, thereby improving sound quality without increasing overall device size or weight
3Stress or pressure
If communication hole is provided between cavities for pressure relief, then pressure buildup is reduced, but cavity isolation is compromised which affects bone conduction effectiveness
Solution Approach 1:
A communication hole is provided in the partition wall between the first and second accommodating cavities. This intermediary structure allows controlled pressure equalization between the two cavities while maintaining their physical separation and acoustic isolation, thus preventing pressure buildup that would affect bone conduction effectiveness without compromising cavity isolation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves sound quality by enlarging the acoustic cavity volume, ensuring a closed environment for bone-conduction and reducing interference, while maintaining structural reliability and assembly convenience.
Implementation Method 1
The bone-conduction speaker has a first central axis and is configured to generate a vibration in a direction of the first central axis
Implementation Method 2
The air-conduction speaker has a second central axis and is configured to generate a vibration in a direction of the second central axis
Data Source
Figure 1
Figure 2
Figure 3a
AI summary
Provided are a speaker assembly (10) and an earphone (1). The speaker assembly (10) includes a housing assembly (100), a bone-conduction speaker (200), and an air-conduction speaker (300). The housing assembly (100) is provided with a first accommodating cavity (111), a second accommodating cavity (112), and a communication hole (113) connecting the first accommodating cavity (111) and the second accommodating cavity (112). The bone-conduction speaker (200) is disposed in the first accommodating cavity (111) and blocks the communication hole (113) to isolate the first accommodating cavity (111) from the second accommodating cavity (112). The air-conduction speaker (300) is disposed in the second accommodating cavity (112). The present disclosure can simply and effectively enlarge a volume of an acoustic cavity formed in an internal space of the speaker assembly (10), thereby improving the sound quality effect of the speaker assembly (10).