Earphone Module Integrated Antenna Touch Circuit Board
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Solution Overview
Problem
Conventional wireless earphones with touch functions require large elastic elements to connect between antennas and circuit boards, occupying significant space and hindering performance improvements.
Innovation Solution
An earphone module integrating touch and antenna structures in a stacked multi-layer design without elastic elements, using a first circuit board with a touch panel layer, grounding layer, and touch circuit layer assembly, where the antenna layer includes an antenna flat portion, feed wire, and short-circuit wire connected to the second circuit board, allowing direct electrical connections and reducing internal space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastic elements are adopted to connect between antenna and circuit board, then connection reliability is improved, but internal space is occupied and space utilization deteriorates
Solution Approach 1:
The patent merges the antenna and circuit board into a single integrated structure where the antenna is directly formed on the circuit board substrate. This eliminates the need for separate elastic connection elements, thereby saving internal space while maintaining electrical connection through the integrated design.
Solution Approach 2:
The patent extracts and removes the elastic connection elements from the system by integrating the antenna directly onto the circuit board. This extraction eliminates the space-consuming elastic elements while preserving the essential electrical connection function through the integrated antenna-circuit board structure.
2Reliability
If elastic elements are adopted to connect between touch panel and circuit board, then touch function reliability is improved, but internal space is occupied and space utilization deteriorates
Solution Approach 1:
The patent merges the touch panel and circuit board into an integrated structure where the touch panel is directly formed on the circuit board substrate. This integration eliminates the need for elastic connection elements between the touch panel and circuit board, saving internal space while maintaining touch functionality through direct electrical connections via conductive layers and through-holes.
3Volume of stationary object
If antenna and touch panel are integrated in stacked multi-layer manner, then space utilization is improved, but antenna performance may deteriorate due to potential interference
Solution Approach 1:
The patent applies local quality by creating spatial separation between the antenna and touch panel conductive layers through multiple substrate layers. The grounding layer is strategically positioned between the antenna and touch panel to provide electromagnetic shielding, ensuring that the antenna region maintains its radiation performance while the touch panel region maintains its sensitivity, thus resolving the potential interference issue in the integrated structure.
Solution Approach 2:
The patent introduces a grounding layer as an intermediary between the antenna and touch panel. This grounding layer acts as an electromagnetic shield that prevents interference between the two functional elements, allowing them to coexist in the integrated multi-layer structure without degrading each other's performance.
Data Source
AI summary
An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.