Earphone Headband Joint Locking for Thinner Housing
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Solution Overview
Problem
Existing earphones have larger dimensions at the junction between the headband assembly and the connecting assembly due to the use of screws, which necessitate deep insertion for connection strength, hindering miniaturization.
Innovation Solution
The earphone design incorporates a telescoping assembly with a locking member and limiting portions to secure the housing components without requiring screws, allowing for reduced thickness and miniaturization by eliminating the need for connecting holes on the second housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to fix the headband assembly and the connecting assembly, then connection strength is ensured, but the dimensions of related components at the junction become larger
Solution Approach 1:
The patent removes the screw connection structure from the junction between the headband assembly and connecting assembly. By extracting the screw fastening mechanism, the design eliminates the need for deep inserting holes and associated structural reinforcements, thereby reducing the thickness of the second housing while maintaining connection integrity through alternative means such as integrated locking features or friction-fit mechanisms.
Solution Approach 2:
The patent integrates the connection function directly into the housing structure itself, merging the fastening feature with the housing body. This integration eliminates the need for separate screw components and deep inserting holes, allowing the second housing to maintain structural strength while reducing overall thickness through unified design.
2Reliability
If screws are inserted to a certain depth to ensure connection strength, then reliability is improved, but the dimensions of related components increase
Solution Approach 1:
The patent employs a nested structure where the connecting assembly is housed within or integrated into the headband assembly junction. This nesting approach allows connection components to be compactly arranged within the available space, reducing the overall volume required at the junction while maintaining secure connection through layered or nested structural elements.
Solution Approach 2:
The patent utilizes thin-walled or flexible housing structures that can maintain structural integrity without requiring deep inserting holes. By optimizing the wall thickness and material properties of the second housing, the design achieves reliable connections with reduced component volume, replacing bulky screw-mounted structures with streamlined thin-shell constructions.
Data Source
AI summary
The present disclosure provides an earphone, which relates to the technical field of electronic devices. The earphone includes a headband assembly, a connecting assembly, and a speaker assembly; the connecting assembly includes a fixing assembly and a telescoping assembly, the fixing assembly includes a housing assembly and a locking member, the housing assembly includes a first housing and a second housing, the telescoping assembly includes a telescoping member; the housing assembly is provided with a plugging hole, the headband assembly has a plugging portion, the plugging portion is plugged within the plugging hole along a telescoping direction, the locking member is disposed to lock the first housing and the plugging portion along the telescoping direction, the second housing is provided with a first limiting portion and a second limiting portion. In the earphone provided in the present disclosure, the locking member locks the first housing and the plugging portion along the telescoping direction, the first limiting portion and the second limiting portion limit a movement of the second housing along the telescoping direction, and the second housing does not need to be provided with a connection hole. The thickness of the second housing at a junction between the headband assembly and the connecting assembly can be reduced, thereby reducing the dimension of the second housing and facilitating the miniaturization of the earphone.