Ear-Clip Earphone Microphone Layout for Better Noise Reduction
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Solution Overview
Problem
Current ear-clip earphones struggle to meet sound reception requirements due to difficulties in noise reduction and sound collection efficiency.
Innovation Solution
The earphone design includes a sound generating unit and an abutment unit connected by an ear hook, with microphones positioned to collect sounds via specific sound inlets, and a processing circuit for noise reduction, ensuring the sound inlets are obstructed by the auricle and aligned towards the mouth for enhanced sound difference and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sound inlet is positioned on the abutment unit, then sound collection is enabled, but noise reduction effectiveness deteriorates due to insufficient sound disparity
Solution Approach 1:
The patent applies local quality by positioning the sound inlet specifically on the abutment unit rather than uniformly distributing sound collection across the earphone structure. This localized placement creates a specific spatial relationship where the sound inlet is obstructed by the auricle, generating acoustic shadow effects that produce sufficient sound disparity between the sound inlet and the microphone in the sound generating unit, thereby enabling effective noise reduction while maintaining sound collection capability.
2Ease of manufacture
If the earphone structure is simplified, then manufacturing ease improves, but sound reception performance deteriorates
Solution Approach 1:
The abutment unit serves multiple functions simultaneously: it provides structural support for the earphone, acts as a mounting platform for the sound inlet, and utilizes the auricle itself as a natural acoustic barrier. This multi-functionality allows the patent to achieve effective noise reduction and sound collection without adding complex separate components, thereby maintaining manufacturing simplicity while improving sound reception performance.
3Volume of moving object
If the sound inlet is positioned closer to the symmetry plane, then structural compactness improves, but noise reduction effectiveness deteriorates due to reduced sound obstruction
Solution Approach 1:
The patent resolves the spatial conflict by utilizing the third dimension (depth/distance from symmetry plane) to position the sound inlet. By placing the sound inlet at a distance of 3-7mm from the symmetry plane, the design creates sufficient acoustic path difference and obstruction effect for noise reduction, while maintaining compact overall dimensions. This dimensional positioning allows both compactness and noise reduction effectiveness to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves noise reduction and sound reception by increasing the disparity between collected sounds, enhancing the noise reduction effect and user experience.
Implementation Method 1
the first microphone collecting a first sound via a first sound inlet on the first housing; the second microphone collecting a second sound via a second sound inlet on the second housing
Implementation Method 2
the sound inlet end is entirely located on a side of the first reference plane facing the symmetry plane... increasing the disparity between collected sounds, thereby enhancing the noise reduction effect
Data Source
AI summary
The present disclosure provides an earphone including a sound generating unit, an abutment unit, and an ear hook. The ear hook has a symmetry plane along a length direction of the ear hook. The abutment unit includes a first housing and a first microphone. The sound generating unit includes a second housing and a second microphone. The earphone further includes a processing circuit configured to perform noise reduction processing based on a first sound and a second sound. The earphone further includes a first reference plane located below the symmetry plane and parallel to the symmetry plane in a wearing state. A distance from the first reference plane to the symmetry plane is less than or equal to 5 mm. A first sound inlet includes a sound inlet end located on an outer wall surface of the first housing.