Earphone Socket Resilient Component Design for Thin Mobile Terminals
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Solution Overview
Problem
Existing mobile terminals with earphone sockets are bulky due to the large housing space required, making them thick and cumbersome.
Innovation Solution
The earphone socket design incorporates a support base with a functional assembly and an earthing resilient component, featuring arc-shaped and circular sleeves, and resilient contact pieces that reduce the overall thickness by minimizing the installation space needed, using thin and strong resilient components like stainless steel or phosphor bronze.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional earphone socket structures are used, then the socket can accommodate all necessary components, but the housing space required becomes large, making the mobile terminal bulky
Solution Approach 1:
The patent applies nesting by placing the resilient component inside the socket housing structure. The resilient component is received within the housing space, allowing it to be nested within the overall assembly rather than requiring separate external space. This nesting approach reduces the total volume required while maintaining all necessary functional components.
Solution Approach 2:
The patent transitions from a traditional multi-dimensional housing structure to a predominantly two-dimensional planar layout. The resilient component features a planar body with contact pieces extending in different directions within the same plane, allowing functional complexity to be achieved through dimensional redistribution rather than increasing overall volume.
2Length of stationary object
If the earphone socket housing space is reduced to make the terminal thinner, then the terminal thickness decreases, but the structural complexity increases
Solution Approach 1:
The patent employs a resilient component made of flexible material that can deform elastically to provide contact pressure. This flexible component replaces rigid structures that would require additional spacing and mounting features, thereby reducing overall thickness while maintaining structural integrity and functional capability through the material's inherent flexibility.
Solution Approach 2:
The patent combines multiple functional elements into a single integrated resilient component. The planar body, multiple contact pieces, and grounding function are merged into one component rather than using separate elements, reducing the number of parts and simplifying the overall structure despite the reduced thickness constraint.
3Force
If resilient components with sufficient pressing force are used, then reliable contact is achieved, but the component thickness increases
Solution Approach 1:
The patent applies local quality by concentrating the pressing force at specific contact pieces that extend outward from the planar body. Rather than distributing thickness uniformly throughout the component, the design provides localized thickness and force application only where contact is needed, maintaining thin overall profile while achieving sufficient pressing force at critical contact points.
Solution Approach 2:
The resilient component incorporates curved or arc-shaped features in its structure, allowing it to deform elastically under compression. The curved geometry enables the component to store and release mechanical energy efficiently, providing sustained pressing force without requiring excessive thickness, as the curvature allows for elastic deformation within a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the thickness of the mobile terminal, aligning with the trend of thinning mobile devices while minimizing material and production costs.
Implementation Method 1
The resilient part is received in the first notch. The third protruding part is arranged on the resilient part and defines a third through hole. The third protruding part is configured to press the earphone plug.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present disclosure relates to an earphone socket (10), a mounting structure (20), and a mobile terminal. The earphone socket (10) includes a support base (100), a functional assembly (201), and an earthing resilient component (500). The functional assembly (201) includes a microphone resilient component (200) including a first arc-shaped sleeve (210), a right channel resilient component (300) including a second arc-shaped sleeve (310), and a left channel resilient component (400) including a circular sleeve (410) and a first resilient contact piece (430). The microphone resilient component (200), the right channel resilient component (300), and the left channel resilient component (400) are fixed on the support base (100). The first resilient contact piece (430) is configured to press the earphone plug (30). The earthing resilient component (500) is fixed on the support base (100).