Earphone Speaker Layout for Larger High-Frequency Diaphragms
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Solution Overview
Problem
Conventional earphone speaker units have limitations in reproducing high-frequency sound due to the size constraints imposed by the placement of the substrate pad of the flexible substrate on the outer side of the high-frequency diaphragm, restricting the expansion of the diaphragm area.
Innovation Solution
The speaker unit design positions the substrate pad of the flexible substrate below the high-frequency diaphragm, allowing for an expanded diaphragm size, and incorporates a coil fixing plate with a space portion to accommodate the power line, enabling automated heat bonding and minimizing interference during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate pad of the flexible substrate is placed on the outer side of the high-frequency diaphragm, then the electrical connection is simplified, but the size of the high-frequency diaphragm is limited
Solution Approach 1:
The substrate pad is relocated from the outer side (horizontal dimension) to the lower side (vertical dimension) of the high-frequency diaphragm. This spatial reconfiguration in another dimension allows the diaphragm to expand outward without interference, while the flexible substrate routes the electrical connection underneath to maintain connectivity.
2Reliability
If the high-frequency diaphragm area is expanded, then high-frequency sound reproduction is improved, but the substrate pad placement becomes problematic
Solution Approach 1:
By moving the substrate pad to the lower side of the diaphragm in the vertical dimension, the patent enables larger diaphragm area for improved high-frequency sound reproduction while maintaining electrical connection through the flexible substrate routed underneath.
3Strength
If the coil fixing plate is rigid, then the voice coil is securely fixed, but interference with the high-frequency diaphragm vibration occurs
Solution Approach 1:
The coil fixing plate is designed with flexibility to allow dynamic movement and vibration of the high-frequency diaphragm while maintaining secure fixation of the voice coil. This dynamic characteristic prevents interference with sound reproduction while ensuring mechanical stability.
Solution Approach 2:
The coil fixing plate is constructed as a flexible component that can accommodate the vibration of the high-frequency diaphragm. This flexibility allows the plate to move with the diaphragm during operation, preventing interference while maintaining voice coil fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances high-frequency sound reproduction by increasing sound pressure in the frequency bands of 10 kHz and above, while minimizing low-frequency sound loss, thus improving overall audio quality.
Implementation Method 1
by arranging the space portion at a position where a power line connected to the high-frequency voice coil passes over the top of a substrate pad for heat bonding
Data Source
AI summary
A speaker unit for an earphone includes a frame including an internal accommodation space; a low-frequency diaphragm; a low-frequency voice coil of a tubular structure connected to the low-frequency diaphragm; a center magnet disposed at the center of the low-frequency voice coil; a first ring-shaped magnet disposed between the center magnet and the low-frequency voice coil; a second ring-shaped magnet disposed on an outer side of the low-frequency voice coil; a high-frequency voice coil disposed on an outer side of the center magnet and including a tubular structure; a flexible substrate disposed on an outer side of the high-frequency voice coil; a coil fixing plate having a plate-shaped structure with one side being coupled to the high-frequency voice coil and another side being coupled to the flexible substrate; and a high-frequency diaphragm disposed above the coil fixing plate and configured to vibrate.