Earpiece Design via 3D Scanning for Misfit-Based Fit Evaluation
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Solution Overview
Problem
Existing hearing device earpieces often fit poorly, leading to wasted time and resources for both users and manufacturers, and user frustration due to repeated fittings.
Innovation Solution
A method for designing earpieces using 3D scan data to determine misfit parameters, evaluating earpiece configurations based on these parameters, and iteratively refining models to ensure a high probability of a proper fit before production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional earpiece design methods are used, then manufacturing process is simple, but fit quality is poor leading to user dissatisfaction
Solution Approach 1:
The patent performs fit evaluation and misfit parameter analysis before manufacturing the earpiece. By using 3D scan data to create a model earpiece and evaluating coupling data with misfit parameters in advance, the system identifies potential fit issues before production, allowing corrective actions to be taken in the design phase rather than after manufacturing.
Solution Approach 2:
The patent replaces traditional manual fitting and trial-and-error methods with an automated computational system. The system uses 3D scanning, digital modeling, and algorithmic evaluation of misfit parameters to objectively assess earpiece fit, substituting subjective manual assessment with precise computational analysis.
2Manufacturing precision
If earpiece designs are tailored specifically to a given user, then fit quality improves, but manufacturing waste increases due to poorly fitting custom designs
Solution Approach 1:
The patent performs fit evaluation before manufacturing personalized earpieces. By evaluating coupling data and misfit parameters in advance using 3D scan data and digital models, the system identifies designs likely to fit poorly before production occurs, preventing waste of custom-manufactured earpieces that would otherwise be discarded due to fit issues.
Solution Approach 2:
The patent implements a feedback mechanism where misfit parameter evaluation results inform design modifications. When the evaluation indicates potential fit problems, the design can be adjusted iteratively before manufacturing, creating a closed-loop system that continuously improves fit quality and reduces the likelihood of producing earpieces that will be discarded.
3Manufacturing precision
If multiple fittings are performed to achieve proper fit, then fit quality improves, but time consumption increases for both user and manufacturer
Solution Approach 1:
The patent performs comprehensive fit evaluation before manufacturing the earpiece using 3D scan data and misfit parameter analysis. By assessing coupling data and identifying potential fit issues in advance through digital modeling, the system aims to achieve proper fit on the first manufacturing attempt, eliminating the need for multiple iterative fittings and associated time losses.
Solution Approach 2:
The patent enables the design system to automatically evaluate and optimize earpiece fit without requiring repeated manual adjustments by technicians. The automated misfit parameter evaluation and iterative design modification process allows the system to self-correct design deficiencies before production, reducing dependency on time-consuming manual refitting processes.
Data Source
AI summary
A method of designing an earpiece for a user, includes: obtaining 3D scan data of an ear; obtaining a model earpiece with an earpiece configuration based on the 3D scan data; determining coupling data indicative of a coupling of the model earpiece, the coupling data including misfit data including one or more misfit parameters; evaluating the earpiece configuration based on the misfit data; and determining information regarding a personalized earpiece based on a result from the act of evaluating the earpiece configuration.