Multilayer EBG Interconnect Board Noise Suppression
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Solution Overview
Problem
Noise propagation through gaps between conductors in electronic apparatuses with multilayer substrates is not effectively mitigated by existing electromagnetic band gap (EBG) structures, leading to insufficient noise countermeasures.
Innovation Solution
A multilayer interconnect board design featuring first and second conductors with gaps, connected via connection members, surrounded by third conductors forming an EBG structure with open stubs or protrusions that overlap gaps, effectively confining noise within the EBG unit cells and preventing leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EBG structure is configured in the conductor layer, then electromagnetic wave propagation is controlled, but noise leaks through gaps between conductors
Solution Approach 1:
The patent embeds multiple conductor layers with different patterns (first conductors on first layer, second conductors on second layer, third conductors surrounding connection points) to form a nested EBG structure. This multi-layer nesting creates overlapping band gap zones that effectively block noise propagation through gaps while maintaining connection integrity.
Solution Approach 2:
The patent transitions from planar EBG structures to three-dimensional multi-layer configurations. By stacking conductor layers vertically and arranging conductors at different heights and positions, the invention creates spatial overlap of band gap zones that prevents noise leakage through gaps between conductors on the same layer.
2Adaptability or versatility
If conductors are disposed with gaps to form EBG structure, then electromagnetic wave control is achieved, but noise radiates from gaps and leaks outside
Solution Approach 1:
The patent places third conductors that surround connection points and overlap gaps between first and second conductors, creating a nested configuration where inner conductors are surrounded by outer conductors. This nesting ensures that gaps are covered by overlapping band gap zones from multiple conductor layers, preventing noise radiation.
Solution Approach 2:
The patent applies different conductor configurations to different locations: first conductors are disposed with gaps for EBG formation, second conductors face the first conductors with corresponding gaps, and third conductors specifically surround connection points and overlap gaps. This localized differentiation ensures noise blocking at critical areas while maintaining EBG functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively suppresses noise propagation by creating a band gap zone that confines electromagnetic waves, preventing noise from radiating outside the electronic apparatus.
Implementation Method 1
a metamaterial configured to control electromagnetic wave propagation in a specific frequency zone is referred to as an electromagnetic band gap structure (hereinafter described as an EBG structure), and noise countermeasures using the EBG structure are attracting attention
Data Source
AI summary
An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).