Electromagnetic Bandgap Structure for Thin Circuit Boards
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Solution Overview
Problem
The existing electromagnetic bandgap (EBG) structures used to counter noise in circuit boards increase the thickness of multi-layered boards due to the addition of extra layers, which is undesirable for thin designs.
Innovation Solution
A structure incorporating a first conductor, overlapping second conductors, a connection member that penetrates and is insulated from the second conductors, and larger third conductors connected to the connection member, forming an EBG structure that reduces the number of layers and thickness while maintaining noise suppression capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional EBG structure with island-like conductor elements arranged over a sheet-like conductive plane is used, then noise suppression capability is achieved, but the number of layers increases and circuit board thickness increases
Solution Approach 1:
The patent merges the island-like conductor elements and the sheet-like conductive plane into a single integrated conductor structure formed by repeated arrangements of connection members. This integration eliminates the need for separate layers, achieving noise suppression functionality while reducing circuit board thickness.
Solution Approach 2:
The connection members serve multiple functions: they act as conductor elements, provide insulation, enable repeated arrangements to form continuous conductive structures, and connect different layers. This multi-functionality reduces the need for additional specialized components and layers.
2Object-affected harmful factors
If additional layers are added to implement EBG structure for noise countermeasures, then electromagnetic wave suppression in specific frequency band is achieved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines multiple functional elements (conductor elements, insulating structures, and connecting components) into an integrated repeated arrangement pattern. This merging reduces the number of discrete layers while maintaining the electromagnetic bandgap structure's noise suppression capability.
3Object-affected harmful factors
If conventional EBG structure with separate island-like conductor elements and conductive plane is used, then proper electromagnetic bandgap functionality is achieved, but manufacturing precision requirements increase due to multiple layer alignment
Solution Approach 1:
The patent merges the previously separate conductor elements and conductive plane into an integrated structure formed by repeated arrangements. This integration eliminates the need for precise alignment between multiple separate layers, reducing manufacturing precision requirements.
Solution Approach 2:
The patent segments the continuous conductive structure into repeated units formed by connection members. This segmentation approach allows for standardized manufacturing of individual units that can be consistently reproduced, reducing overall manufacturing complexity and precision requirements.
Data Source
AI summary
A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101) that penetrates the conductors (111, 131, 151), that is connected to the conductor (151), and that is insulated from the conductors (111, 131), openings (112, 132) that are formed in the conductors (111, 131), respectively, and which the connection member (101) passes through, and conductor elements (121, 141) that are formed to be opposed to the openings (112, 132), that are connected to the connection member (101) passing through the openings (112, 132), and that are larger than the openings (112, 132). The number of layers in which the conductor elements (121, 141) are located is two or more and less than or equal to the number of layers in which the conductors (111, 131) are located.