EBG Waveguide PCB Interconnect for High-Rate Contactless Data Links

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Solution Overview

Problem

Existing solutions for data transmission between printed circuit boards in the millimeter-wave band face challenges such as high losses, low data rates, large sizes, complex manufacturing, and strong dependence on conductive element contact quality, particularly in wireless communication methods like NFC and optical communication which require precise mechanics and shielding, limiting their suitability for high-speed applications.

Innovation Solution

A device featuring a waveguide surrounded by electromagnetic band gap (EBG) structures and directional antennas integrated into printed circuit boards, allowing for efficient electromagnetic signal transmission without galvanic contact, with EBG structures preventing leakage and enabling high-speed data transfer up to 2 Gbps, while simplifying manufacturing and reducing assembly tolerances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If wireless communication methods like NFC or optical communication are used for data transmission between PCBs, then wireless connection is achieved, but data transmission rate is limited (NFC up to 2.1 Mbps) or precise mechanical alignment and beam control are required

Engineering Contradiction:
Improvewireless connectionVSAvoiddata transmission rate
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent transitions from NFC's 13.56 MHz carrier frequency to millimeter-wave frequencies (24 GHz, 60 GHz, or higher), fundamentally changing the frequency parameter to enable much higher data transmission rates while maintaining wireless operation. This frequency parameter change allows achieving >2 Gbps data rates as required.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces optical communication's precise mechanical alignment and beam control mechanisms with a waveguide-based electromagnetic field confinement system. The waveguide structure with EBG structures eliminates the need for mechanical adjustment mechanisms, making the system more robust and suitable for mass production while achieving high data rates.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If conventional galvanic connection using metal conductors is used, then reliable electrical connection is achieved, but mechanical and thermal loads cause contact degradation and early failure

Engineering Contradiction:
Improveelectrical connectionVSAvoidcontact lifespan
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent replaces the mechanical galvanic contact system with a wireless electromagnetic field-based transmission system. The waveguide structures on opposing PCBs create a confined electromagnetic field for signal transmission without physical contact, eliminating mechanical wear, thermal expansion issues, and contact degradation, thereby achieving both reliability and extended operational lifespan.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If optical communication is used for high-rate wireless data transmission, then high data transmission rate is achieved, but direct view between transmitter and receiver is required and beam control increases occupied space

Engineering Contradiction:
Improvedata transmission rateVSAvoidoccupied space
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The patent replaces optical communication's beam control mechanisms with an electromagnetic waveguide-based system. The waveguide structures confine and guide the electromagnetic fields between PCBs without requiring precise mechanical alignment or large adjustment mechanisms, achieving high data rates with reduced occupied space and improved robustness.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If SMD connectors or RF connectors are used for board-to-board connection, then electrical connection is achieved, but assembly time increases and minimum distance between circuit boards must be maintained

Engineering Contradiction:
Improveelectrical connectionVSAvoidassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical connector assembly process with a wireless electromagnetic field-based transmission system. The waveguide structures are integrated into the PCB design, eliminating the need for separate connector assembly steps, reducing assembly time, and removing minimum distance requirements between boards while maintaining reliable signal transmission.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves efficient, low-loss data transmission at high rates with reduced size and manufacturing complexity, eliminating the need for precise mechanical alignment and shielding, making it suitable for mass production and applications in millimeter-wave and subTHz bands.

Implementation Method 1

a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and comprising at least one electromagnetic band gap (EBG) structure

Methodology Applied
Scientific EffectElectromagnetic band gap (EBG):

Implementation Method 2

at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted... provide a wireless channel for transmitting electromagnetic signals

Methodology Applied
Scientific EffectElectromagnetic radiation:

Data Source

PatentUS11870507B2Wireless board-to-board interconnect for high-rate wireless data transmission
Publication Date: 2024.01.09 SAMSUNG ELECTRONICS CO LTD
  • US11870507B2 patent drawing
  • US11870507B2 patent drawing
  • US11870507B2 patent drawing

AI summary

Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.