Semiconductor ECC Circuit Fuse-Based Address Replacement

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Solution Overview

Problem

Conventional semiconductor memory devices have limited error detection and correction capabilities due to the restricted number of parity bits, which restricts the number of DQ bits that can be verified and corrected.

Innovation Solution

A semiconductor device with a memory region and an error check and correction (ECC) region that includes a redundancy region with fuses, allowing for the detection of errors and replacement of defective addresses with redundancy lines, independent of the number of DQ bits, thereby enhancing error correction capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional ECC circuit with limited parity bits is used, then device complexity is reduced, but error detection and correction capability is limited

Engineering Contradiction:
Improveerror detection and correction capabilityVSAvoidECC circuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from traditional parity bit-based ECC to a fuse-based address replacement mechanism. Instead of adding more parity bits (horizontal expansion), the invention introduces a new dimensional approach by using fuses to store and replace defective addresses, fundamentally changing the ECC architecture from bit-level correction to address-level replacement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces fuses as an intermediary element between the memory array and the ECC logic. The fuses serve as a mediator that stores defective address information and enables replacement with redundancy line addresses, acting as a bridge that decouples the error correction function from the traditional parity bit approach.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If number of parity bits is increased to improve error correction capability, then error detection capability is improved, but the number of DQ bits that can be verified is restricted

Engineering Contradiction:
Improveerror correction capabilityVSAvoidnumber of verifiable DQ bits
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent segments the error correction function into two independent parts: (1) parity bits for detecting data errors in DQ bits, and (2) fuses for replacing defective address bits. This segmentation allows each component to operate independently, enabling the system to correct both data errors and address errors without the traditional trade-off between correction capability and verifiable DQ bit capacity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fuse-based address replacement mechanism serves multiple functions: it stores defective address information, enables redundancy line selection, and provides address error correction. This multi-functional approach replaces what would traditionally require multiple layers of parity bits, thereby increasing the number of verifiable DQ bits while maintaining or improving overall error correction capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If fuse-based address replacement is implemented, then ECC capability is improved beyond 1-2 bit limitation, but device complexity increases

Engineering Contradiction:
ImproveECC capabilityVSAvoidredundancy region complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a copy of the address space in the form of redundancy lines that mirror the structure of the main memory array. These redundancy lines are activated through fuse-based address replacement, allowing defective addresses to be copied to functional redundancy locations. This copying mechanism enables correction of multiple bit errors without proportionally increasing the complexity of the correction logic.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS8996956B2Semiconductor device including ECC circuit
Publication Date: 2015.03.31 SK HYNIX INC
  • US8996956B2 patent drawing
  • US8996956B2 patent drawing
  • US8996956B2 patent drawing

AI summary

A semiconductor device includes a memory region configured to include a plurality of banks and a redundancy region within each of the banks and an error check and correction (ECC) region configured to detect an address of the memory region at which an error has occurred and correct a defect of the memory region by replacing the address at which the error has occurred with a redundancy line of the redundancy region based on address information.