Eccentric Fin Cold Plate Layout for Uniform Chip Cooling
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Solution Overview
Problem
Current liquid cooling configurations for heat-generating electronic devices, such as chipsets, fail to effectively manage temperature distribution due to centric fin placement, leading to localized high temperatures and inefficient heat dissipation.
Innovation Solution
An eccentric fin arrangement is implemented within a cold plate module, positioned off-center relative to the coolant flow channel, which is thermally coupled to both the base plate and top cover, optimizing heat dissipation by matching the thermal footprint of the heat source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fins are placed in a centric location, then structural integrity is maintained, but heat accumulates at downstream location resulting in local high temperature distribution
Solution Approach 1:
The fin arrangement is positioned in an asymmetric (eccentric) location within the cold plate, specifically offset from the center towards the downstream side. This asymmetric positioning allows the fins to intercept heat more effectively at the location where heat accumulates, improving temperature distribution uniformity while maintaining adequate structural integrity through the asymmetric support structure
2Strength
If fins are placed in a centric location, then structural integrity is maintained, but thermal resistance increases due to heat accumulation
Solution Approach 1:
The fin arrangement is positioned in an asymmetric (eccentric) location within the cold plate, specifically offset from the center towards the downstream side. This asymmetric positioning allows the fins to intercept heat more effectively at the location where heat accumulates, improving temperature distribution uniformity while maintaining adequate structural integrity through the asymmetric support structure
3Strength
If fins are placed in a centric location, then structural integrity is maintained, but cooling efficiency deteriorates due to localized high temperatures
Solution Approach 1:
The fin arrangement is positioned in an asymmetric (eccentric) location within the cold plate, specifically offset from the center towards the downstream side. This asymmetric positioning allows the fins to intercept heat more effectively at the location where heat accumulates, improving temperature distribution uniformity while maintaining adequate structural integrity through the asymmetric support structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The eccentric fin arrangement reduces thermal resistance by approximately 7% compared to centric configurations, resulting in a cooler working fluid temperature and improved temperature uniformity around the heat-generating device.
Implementation Method 1
The fin arrangement is thermally coupled to the flow channel
Implementation Method 2
a flow channel for a liquid coolant that flows along a flow direction
Implementation Method 3
The fin arrangement is eccentrically located relative to the cold plate module
Data Source
AI summary
A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.