Eccentric Hub Wafer Transfer Robot for Vacuum Cluster Throughput
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Solution Overview
Problem
Conventional substrate handling systems in semiconductor processing are inadequate for efficiently transferring substrates within cluster tool environments, particularly as the number of processing chambers increases, leading to reduced throughput and potential thermal non-uniformity and particle contamination.
Innovation Solution
The introduction of a transfer apparatus with a central hub and eccentric hub, allowing for both rotational and lateral movement of substrates, coupled with an end effector having multiple arms and end pieces, enables efficient transfer and positioning of substrates within a transfer region housing, accommodating multiple substrate supports and maintaining a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate handling systems are used in cluster tools with increasing number of processing chambers, then the system complexity increases, but substrate throughput decreases and thermal non-uniformity occurs
Solution Approach 1:
The substrate handling system is segmented into multiple independent robotic arms (first robotic arm, second robotic arm) that can operate simultaneously and independently. Each arm is responsible for specific substrate transfer tasks between different chamber types, allowing parallel processing and improving throughput without requiring a single complex centralized system.
Solution Approach 2:
The system transitions from conventional linear or radial chamber arrangements to a three-dimensional configuration where processing chambers are positioned at different vertical levels (first vertical level, second vertical level) and horizontal positions. This spatial arrangement allows multiple robotic arms to access substrates from different directions simultaneously, increasing throughput while managing system complexity through efficient space utilization.
2Loss of time
If conventional substrate transfer methods are used, then queue times increase, but implementing faster transfer mechanisms may cause thermal non-uniformity and particle contamination
Solution Approach 1:
A dedicated transfer chamber serves as an intermediary space between processing chambers, where substrates can be temporarily held and transferred between different chamber types. This intermediary structure allows for controlled, rapid substrate movement without exposing substrates to thermal shocks or contamination risks, as the transfer chamber maintains appropriate environmental conditions during the transfer process.
Solution Approach 2:
The system enables continuous substrate processing by implementing overlapping operation cycles where the first robotic arm transfers substrates while the second robotic arm simultaneously performs transfers. This continuous operation eliminates queue times and waiting periods, maintaining steady substrate flow through the cluster tool without causing thermal non-uniformity or contamination through rapid, discontinuous movements.
3Productivity
If the number of processing chambers is increased to improve productivity, then substrate throughput increases, but thermal non-uniformity and contamination risks increase
Solution Approach 1:
Different chamber types (deposition chamber, etch chamber, cleaning chamber) are positioned at specific locations and vertical levels based on their functional requirements. Each chamber maintains its local environmental conditions independently, and the robotic arms are designed to transfer substrates between chambers with compatible thermal and contamination characteristics, minimizing thermal non-uniformity and contamination risks while enabling high throughput through multiple specialized processing stations.
Data Source
AI summary
Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.