Eccentric-Roller Wafer Holder for Faster Backside Cleaning
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Solution Overview
Problem
The adherence of foreign matters such as fine particles and dust to the back surface of a wafer can cause separation from the stage reference surface or inclination of the wafer, leading to patterning deviation and focal distance deviation in exposure apparatuses, necessitating efficient substrate surface processing.
Innovation Solution
A substrate holding apparatus with rollers and eccentric shafts that rotate the substrate, combining circular and translational motions to increase processing efficiency by enhancing the relative speed between the processing head and the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is held and rotated using conventional chuck mechanisms, then the substrate can be processed, but the processing efficiency is insufficient due to limited relative speed between processing head and substrate surface
Solution Approach 1:
The patent applies dynamics by making the substrate holding mechanism movable and adjustable. The substrate is held by rollers that can be pressed against the substrate periphery, and the entire substrate holding apparatus can be moved to create combined rotational and translational motion. This dynamic configuration enables higher relative speed between the processing head and substrate surface, directly improving processing efficiency while maintaining substrate stability.
2Ease of operation
If foreign matter is not removed from the back surface of the substrate, then the substrate can be handled easily, but patterning deviation and focal distance deviation occur in exposure apparatuses
Solution Approach 1:
The substrate holding apparatus with rollers can perform multiple functions: it holds the substrate for rotation, enables efficient surface processing, and prepares the substrate for exposure by ensuring the back surface is clean and free of foreign matter. The same rolling mechanism that improves processing efficiency also facilitates proper substrate positioning and orientation for exposure, thereby maintaining both ease of operation and manufacturing precision.
3Productivity
If the substrate surface is processed with high relative speed, then processing efficiency is improved, but the complexity of the substrate holding mechanism increases
Solution Approach 1:
The patent merges the substrate holding function with the motion generation function. The rollers both hold the substrate and generate rotational motion through their pressing action. The substrate holding apparatus is integrated with the motion mechanism, combining what would traditionally be separate functions into a unified system. This merging reduces overall system complexity while achieving high processing rates through the combined rotational and translational motion of the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently processes the substrate surface by increasing the processing rate through synchronized rotation and circular motion, effectively removing foreign matter and preventing deviations.
Implementation Method 1
rollers capable of contacting a periphery of the substrate... rotate the rollers... causing the substrate to make a circular motion
Data Source
AI summary
A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.