Intracardiac Echo Interposer for Compact Cable-to-Imager Routing
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Solution Overview
Problem
Existing imaging catheters face challenges in connecting electrical cables to imaging components due to tension issues and limited space, with direct connections causing stress and separate flex circuits being unsuitable for catheter use.
Innovation Solution
An interposer device with a multi-layered substrate structure is used to interconnect imaging components and electrical cables, featuring conductive contact pads plated with ENEPIG for soldering and wirebonding, and precise signal traces for dense signal distribution without logic, suitable for catheter assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate flex circuit or PCB is used to interconnect the electrical cable and the imaging component, then tension on the imaging component is reduced, but the device size becomes too large for use in imaging catheters
Solution Approach 1:
The patent merges the electrical cable connection and imaging component mounting functions into a single integrated substrate structure. The substrate directly receives the electrical cable and provides mounting for the imaging component, eliminating the need for separate flex circuits or PCBs while maintaining mechanical isolation to reduce tension on the imaging component.
Solution Approach 2:
The substrate acts as an intermediary element between the electrical cable and the imaging component. It provides a rigid mounting surface for the imaging component while the flexible cable connects to the substrate, allowing the substrate to absorb and isolate mechanical tension away from the imaging component.
2Device complexity
If direct connection or soldering is used to interconnect the electrical cable to the imaging component, then device complexity is reduced, but tension is created on the imaging component during catheter maneuvering
Solution Approach 1:
The patent segments the interconnection system into three distinct parts: the electrical cable, the substrate, and the imaging component. The substrate serves as a separate mounting platform that physically decouples the cable from the imaging component, allowing the cable to move independently without transmitting tension to the imaging component.
Solution Approach 2:
The substrate functions as an intermediary mounting platform that receives both the electrical cable and the imaging component. This intermediate structure allows the cable to connect to the system without directly attaching to the imaging component, thereby preventing tension transmission while adding minimal complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer device provides a stable and compact connection between imaging components and cables, reducing the form factor by at least an order of magnitude compared to traditional PCBs or flex circuits, enabling efficient signal routing and additional functionalities like power regulation.
Implementation Method 1
The top metal layer is plated with electroless nickel palladium immersion gold (ENEPIG) to from conductive contact pads. The ENEPIG material is suitable for both soldering and wirebonding.
Data Source
AI summary
An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.