Electronic Control Unit Heat Conducting Component Thermal Management
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Solution Overview
Problem
Conventional electronic control units for electric power steering devices face excessive temperature increases in heat generating components due to limited heat release paths, leading to potential malfunction or failure when high currents are applied.
Innovation Solution
The electronic control unit incorporates heat conducting components with high thermal conductivity, strategically placed between heat generating components on the substrate to facilitate heat dissipation and reduce thermal interference, utilizing a heat sink and heat conducting member to effectively manage heat release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If resin of the substrate is exposed as a heat-conduction limiting portion between heat generating components, then thermal interference between components is restricted, but temperature of heat generating components excessively increases due to limited heat releasing paths
Solution Approach 1:
A heat conducting component is introduced as an intermediary element between heat generating components and the substrate. This mediator has high heat conductivity and forms heat conducting paths that extend from beneath the heat generating components to the substrate, enabling efficient heat transfer while maintaining the heat-conduction limiting function of the exposed resin portions.
Solution Approach 2:
The heat conducting paths are formed in the thickness direction (vertical dimension) of the substrate rather than relying solely on horizontal heat dissipation. This dimensional approach creates three-dimensional heat conduction channels that bypass the limitations of surface-level heat management.
2Temperature
If heat conducting component is provided between heat generating components, then heat is conducted away from components, but device complexity increases
Solution Approach 1:
The heat conducting component is integrated with the substrate structure, merging the heat dissipation function with the existing substrate. The heat conducting paths are formed within the substrate thickness, combining multiple functions into a unified structure rather than adding separate external cooling components.
Solution Approach 2:
The substrate serves dual functions: as the mechanical support for mounting heat generating components and as a heat sinking structure with integrated heat conducting paths. This multi-functionality eliminates the need for separate heat dissipation structures, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively restricts excessive temperature increases in heat generating components, preventing malfunctions and ensuring reliable operation even under high current conditions.
Implementation Method 1
The heat conducting component is formed of a material having a heat conductivity equal to or higher than a predetermined value, and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components
Data Source
AI summary
An electronic control unit includes: a substrate a plurality of heat generating components that are provided on one surface of the substrate and generate heat during operation; a heat conducting component that is formed of a material having a heat conductivity equal to or higher than a predetermined value and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components; and a controller that is provided on the substrate and controls the operation of each of the plurality of heat generating components to control the object to be controlled.