Electronic Control Unit Heat Dissipation via Ground Pattern
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Solution Overview
Problem
Existing electronic control units for electric power steering systems face challenges in effectively radiating heat generated by high-current electric and electronic components, leading to size constraints and heat interference issues.
Innovation Solution
The electronic control unit incorporates a metal plate member, a resin board, a semi-conductor module, a capacitor, and multiple ground patterns to efficiently transmit and radiate heat, with a fixing member and connector configuration that blocks heat transfer to prevent interference between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electric and electronic parts are mounted on a printed circuit board, then the electronic control unit can perform its control function, but heat is generated that cannot be effectively radiated
Solution Approach 1:
The invention divides the printed circuit board into functionally distinct regions: a first region for mounting heat-generating components (semiconductor module, capacitor) and a second region for mounting other components. This spatial segmentation allows heat-generating components to be isolated and their heat to be directed toward the heat radiating structure, while other components remain in a cooler zone, thereby resolving the contradiction between maintaining control function and managing heat radiation.
Solution Approach 2:
The invention introduces a heat radiating structure as an intermediary element that is thermally coupled to the heat-generating components through the first ground pattern. This intermediary structure acts as a heat transfer medium, conducting heat away from the electronic components and dissipating it to the surrounding environment, thus enabling effective heat radiation while preserving the control function of the mounted components.
2Volume of moving object
If the electronic control unit is made smaller, then space efficiency is improved, but heat radiating performance deteriorates
Solution Approach 1:
The invention transitions from planar heat dissipation (relying only on the surface area of the printed circuit board) to three-dimensional heat management by incorporating a heat radiating structure that extends in the vertical dimension. This dimensional change allows heat to be conducted through the ground pattern to the radiating structure, which then dissipates heat to the surrounding air, enabling effective heat radiation in a compact volume and thus resolving the contradiction between miniaturization and heat radiating performance.
3Temperature
If heat is radiated more effectively, then temperature control is improved, but heat interference between components occurs
Solution Approach 1:
The invention applies different thermal characteristics to different regions of the printed circuit board. The first region, where heat-generating components are mounted, is designed with thermal coupling to the heat radiating structure for active heat removal. The second region, where other components are mounted, is positioned in a thermally favorable zone with reduced heat exposure. This local differentiation of thermal properties enables effective heat radiation from critical components while preventing heat interference with other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively radiates heat from the semi-conductor module and capacitor, reducing size requirements and preventing heat interference, thereby enhancing the heat radiating performance and maintaining component stability.
Implementation Method 1
heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member
Implementation Method 2
the heat from the semi-conductor module and the capacitor can be effectively radiated into the air
Data Source
AI summary
A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the first surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.