Motor Drive ECU Heat Sink Integration for Compact Cooling
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Solution Overview
Problem
The existing motor drive apparatus for vehicles, particularly in power steering systems, faces challenges in downsizing due to the need for a large cover member to effectively cool semiconductor switching elements, which hinders further reduction in size.
Innovation Solution
The motor drive apparatus incorporates an ECU housing with a heat sink and module receiving portions that allow semiconductor modules to be directly or indirectly cooled, reducing the size by eliminating the need for a large cover member and enhancing heat radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large cover member is used to cool semiconductor switching elements, then heat dissipation is improved, but the apparatus size increases
Solution Approach 1:
The invention merges the cover member with the heat sink by integrating the semiconductor module mounting structure directly into the heat dissipation component. The cover member is designed to serve dual purposes: enclosing the internal components and acting as a heat sink with integrated fin structures for heat dissipation. This eliminates the need for a separate large cover member while maintaining effective cooling of the semiconductor switching elements.
Solution Approach 2:
The cover member is transformed into a multi-functional component that simultaneously performs mechanical protection (enclosing the ECU housing), structural support (mounting the semiconductor modules), and thermal management (heat dissipation through integrated fins). This universal design allows a single component to fulfill multiple roles, reducing the overall apparatus size while maintaining heat dissipation effectiveness.
2Temperature
If multiple semiconductor switching elements are cooled using a cover member, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The invention combines multiple cooling functions into a single integrated heat sink structure. Instead of providing separate cooling mechanisms for each semiconductor switching element, the heat sink is designed with multiple fin structures that can simultaneously cool multiple modules mounted on the cover member. This unified approach reduces device complexity while maintaining effective heat dissipation for all semiconductor elements.
Solution Approach 2:
The heat sink is segmented into multiple fin structures that correspond to different semiconductor module locations. Each fin section can independently dissipate heat from its corresponding semiconductor element, allowing for modular heat management. This segmentation enables efficient cooling of multiple elements without requiring complex individual cooling systems for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a more compact motor drive apparatus while maintaining effective heat dissipation, thereby addressing the size limitations of previous designs.
Implementation Method 1
the heat sink including a module receiving portion, the module receiving portion including a heat-receiving surface
Implementation Method 2
a heat generated in each of the plurality of semiconductor modules is transmitted from the heat-radiating surface directly to the heat-receiving surface
Implementation Method 3
a module retaining section pressing the heat-radiating surface to the heat-receiving surface to retain each of the plurality of semiconductor modules
Data Source
AI summary
A motor drive apparatus includes a motor; and an ECU. The ECU includes an ECU housing. The ECU housing includes a heat sink having a module receiving portion. The module receiving portion includes a heat-receiving surface and an opening portion open to one-end side of the ECU housing. The ECU further includes a control substrate received by the ECU housing to be perpendicular to the heat-receiving surface and to face the motor; a plurality of semiconductor modules each received in the module receiving portion and connected electrically with the control substrate to control a power supply of the motor. Each of the plurality of semiconductor modules includes a heat-radiating surface at an outer portion thereof. The ECU further includes a module retaining section pressing the heat-radiating surface to the heat-receiving surface to retain each of the plurality of semiconductor modules in the module receiving portion.