ECU Housing with Anisotropic Thermal Conductive Plastic
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Solution Overview
Problem
Existing electronic control unit (ECU) housings with passive cooling features are costly and do not provide sufficient thermal dissipation, leading to performance issues due to heat generation from ECU and other electronics.
Innovation Solution
A housing assembly featuring a frame portion made of high-strength plastic and a thermally conductive plastic heat sink portion with anisotropic thermal conductivity properties, optimized through injection molding to enhance thermal conduction in specific directions, providing improved cooling while reducing material and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional passive cooling features are used in ECU housings, then manufacturing cost is reduced, but thermal dissipation capability is insufficient
Solution Approach 1:
The patent applies composite materials by combining thermally conductive plastic material with conventional plastic material in a single housing assembly. The thermally conductive plastic is used specifically for the heat sink portion that contacts the PCB, while the conventional plastic is used for the frame portion. This composite approach enables improved thermal dissipation capability in the critical heat transfer zones while maintaining cost-effectiveness and ease of manufacture through injection molding processes.
2Temperature
If thermally conductive plastic material is used for the heat sink portion, then thermal conduction is improved, but material strength is reduced
Solution Approach 1:
The patent applies local quality by using different materials in different portions of the housing assembly. The thermally conductive plastic material is used specifically in the heat sink portion where high thermal conduction is required, while the conventional plastic material with greater strength is used in the frame portion where structural strength is critical. This localized material selection optimizes thermal performance without compromising overall structural integrity.
3Temperature
If isotropic thermal conductivity is used in the heat sink material, then manufacturing is simplified, but thermal dissipation efficiency is reduced
Solution Approach 1:
The patent applies parameter changes by utilizing anisotropic thermal conductivity in the thermally conductive plastic material. The material is formulated and processed to provide different thermal conductivity values in different directions, with higher thermal conductivity oriented toward the PCB contact surfaces. This directional thermal conductivity optimization enhances heat dissipation efficiency from the electronics while the material remains processable through injection molding, balancing manufacturing feasibility with thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by ECU and electronics, offering improved thermal management and cost reduction by using injection-molded plastics with anisotropic thermal properties, resulting in a lightweight, cost-effective housing assembly.
Implementation Method 1
a heat sink portion that is supported on the frame portion and is formed of a second material... the second material is a thermally conductive plastic
Implementation Method 2
The second material is thermally anisotropic and is configured to provide greater thermal conductivity in predetermined directions than in other directions
Implementation Method 3
A method of optimizing the thermal conduction properties of a component made of a thermally conductive plastic material includes providing a molding tool and injection configuration for an injecting molding process
Data Source
AI summary
A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.