ECU Power Device Mounting With Integrated Thermal Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic control units face challenges in efficiently dissipating heat from power devices while ensuring effective temperature monitoring and secure mounting, often requiring complex spring or pressing components that complicate assembly and heat transfer.
Innovation Solution
The electronic control unit integrates a temperature sensor on the same circuit board as the power device, with thermal contact on one side and a heat dissipation device on the other, utilizing an insulating and heat-conducting structure and a flexible film to eliminate gaps, and employs a force transfer element to secure the power device against the housing, replacing traditional springs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spring or pressing component is used to secure the power device, then the power device is firmly mounted and heat transfer is facilitated, but the assembly process becomes more complex and the structure is more complicated
Solution Approach 1:
The patent removes the spring or pressing component from the mounting structure, replacing it with a simplified design where the power device is directly secured to the housing through integrated mounting features. This extraction of the elastic component eliminates the associated complexity while maintaining secure mounting through alternative mechanical means such as recesses, clips, or direct fastening structures.
Solution Approach 2:
The housing structure is designed to perform multiple functions: it provides mechanical support, facilitates heat transfer, and secures the power device through integrated mounting features. The housing serves as both the structural enclosure and the mounting mechanism, eliminating the need for separate pressing components.
2Measurement precision
If the temperature sensor is mounted on the power device, then temperature monitoring is achieved, but the heat transfer path becomes longer and thermal resistance increases
Solution Approach 1:
The patent introduces a thermally conductive adhesive or thermal interface material as an intermediary between the temperature sensor and the power device. This intermediary substance improves thermal coupling and reduces thermal resistance at the interface, enabling more accurate temperature measurement while minimizing energy loss in the heat transfer path.
Solution Approach 2:
The temperature sensor is integrated directly onto the power device surface or embedded within the housing in close proximity to the power device, merging the sensing function with the structural components. This integration minimizes the heat transfer path length and reduces thermal resistance, allowing accurate temperature monitoring without significant energy loss.
3Ease of manufacture
If gaps exist between the power device and housing, then assembly is easier, but heat transfer from the power device is reduced
Solution Approach 1:
The patent employs thermally conductive adhesive materials with optimized thermal conductivity parameters to fill gaps between the power device and housing. By selecting materials with appropriate thermal conductivity values, the design maintains ease of assembly with gap tolerance while ensuring sufficient heat transfer efficiency through the adhesive layer.
Solution Approach 2:
The patent uses composite thermal interface solutions combining multiple materials with complementary properties: a thermally conductive adhesive for gap filling, potentially combined with thermal pads or phase change materials. This composite approach provides both mechanical compliance for easy assembly and high thermal conductivity for effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and temperature monitoring efficiency by shortening heat transfer paths and ensuring timely temperature data retrieval, while simplifying assembly and reducing thermal resistance.
Implementation Method 1
the temperature sensor is in thermal contact with the first side to sense the temperature of the power device
Implementation Method 2
the heat dissipation device is in thermal contact with the second side
Data Source
AI summary
An electronic control unit includes a power device, the power device having a first side and a second side opposite to each other. The power device is electrically connected to a circuit board. A temperature sensor is mounted to the circuit board, the temperature sensor and the circuit board are both located on the first side of the power device, and the temperature sensor is in thermal contact with the first side to sense the temperature of the power device. A heat dissipation device is in thermal contact with the second side. The configuration can effectively obtain the temperature of the power device and shorten the heat transfer path.