Shielded ECU Housing Layout for RF Noise Near Tall Components
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Solution Overview
Problem
Existing electronic control devices face challenges in effectively suppressing radio-frequency electromagnetic noise, particularly near tall electronic components, due to difficulties in providing connection portions that are insufficient for noise suppression.
Innovation Solution
The electronic control device incorporates a duplexing member between the housing and circuit board, which is connected to the board's ground pattern through EMI gaskets, forming cutouts to avoid contact with tall components and partitioning connectors, thereby confining noise sources and improving shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If connection portions are provided to suppress noise, then radio-frequency electromagnetic noise suppression is improved, but it becomes difficult to provide connection portions near tall electronic components
Solution Approach 1:
The patent transitions from a two-dimensional planar connection structure to a three-dimensional立体 connection structure by having the duplexing member extend vertically between the housing and circuit board. This allows connection portions to be positioned in the vertical dimension near tall electronic components, resolving the spatial conflict between noise suppression requirements and component height constraints.
Solution Approach 2:
The duplexing member acts as an intermediary structure that bridges the housing and circuit board. It provides multiple connection portions that can be positioned optimally near tall electronic components without direct interference, enabling effective noise suppression while accommodating component height constraints through its intermediate positioning.
2Strength
If the housing structure is reinforced to improve strength, then housing strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the duplexing member with the housing structure by forming an integral connection between them. This integration reinforces the housing structure to improve strength while avoiding the need for separate reinforcement components, thereby reducing manufacturing complexity and maintaining ease of production.
3Productivity
If components are arranged in high-density configuration, then productivity and space utilization are improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent segments the housing interior space using the duplexing member, creating distinct regions that facilitate heat management. This segmentation allows for strategic placement of heat-generating components while maintaining high overall density, and enables targeted heat dissipation pathways without requiring excessive spacing between components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses radio-frequency electromagnetic noise, enhances housing strength, and allows for high-density component arrangement while reducing manufacturing costs and improving heat dissipation.
Implementation Method 1
The duplexing member 203 is connected to a ground pattern on the circuit board 101 through EMI gaskets 103
Data Source
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AI summary
An electronic control device comprising: a housing having conductivity; a circuit board that is arranged in the housing and has a first electronic component mounted on a mounting surface; an external connection portion that is electrically connected to the circuit board and is connectable to a device outside the housing; and a duplexing member that has conductivity and is arranged between an inner surface of the housing and the mounting surface of the circuit board, in which the duplexing member forms a cutout portion to avoid contact between the duplexing member and the first electronic component, and further forms a partition portion that partitions the external connection portion between the housing and the circuit board.