ECU Substrate Vias for Soldering Heat Dissipation
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Solution Overview
Problem
The existing electronic control units (ECUs) face challenges in heat dissipation during the soldering process, leading to poor solderability and connectivity issues between the substrate and terminals due to inadequate heat transfer from one surface of the substrate to another.
Innovation Solution
The implementation of vias in the substrate facilitates heat transfer from one surface to another during soldering, improving the solderability of terminals by directing heat dissipation from the first surface to the second surface through strategically placed circuit patterns and vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation during soldering is not improved, then the substrate structure remains simple, but solderability and connectivity between substrate and terminals deteriorate
Solution Approach 1:
The substrate is segmented into multiple functional layers including a first substrate layer, second substrate layer, and insulating layer. Vias are segmented into first vias extending through the first substrate layer and second vias extending through the second substrate layer, allowing heat dissipation to be distributed across multiple pathways rather than relying on a single structure.
Solution Approach 2:
Heat dissipation via holes are strategically positioned at specific locations on the substrate, particularly near terminal connection areas. The via holes are selectively distributed to create localized heat dissipation zones where they are most needed for improving solderability, rather than uniformly across the entire substrate.
2Reliability
If heat dissipation is improved during soldering, then connectivity between substrate and terminals improves, but the substrate requires additional structures
Solution Approach 1:
The via holes serve multiple functions simultaneously: they provide electrical connectivity between different substrate layers and terminals, and they act as heat dissipation pathways during the soldering process. This multi-functionality allows the same structural elements to address both connectivity and heat management requirements without adding separate dedicated components.
Solution Approach 2:
The electrical connection pathways (vias) and heat dissipation pathways (via holes) are merged into the same substrate structure. The via holes are integrated into the substrate layers and circuit patterns, combining the functions of electrical interconnection and thermal management in a single unified structure rather than using separate systems.
3Manufacturing precision
If conventional soldering is used without heat dissipation improvement, then the manufacturing process is simple, but soldering quality and terminal connectivity deteriorate
Solution Approach 1:
The heat dissipation via holes are pre-formed into the substrate structure before the soldering process begins. The via holes are created during substrate fabrication, and heat dissipation barriers are applied to the inner walls of via holes in advance, so that when soldering occurs, the heat dissipation infrastructure is already in place to ensure high-quality solder joints.
Solution Approach 2:
Heat dissipation barriers are introduced as intermediary materials coating the inner walls of via holes. These barriers mediate between the soldering heat and the substrate material, controlling heat transfer rates and preventing excessive heat absorption that would compromise soldering quality. The barriers act as thermal interface materials to optimize the thermal environment during soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the soldered connection quality between terminals and the substrate, improving connectivity and reducing the risk of heat-related issues during the soldering process.
Implementation Method 1
The vias are disposed in the substrate so as to facilitate heat transfer from a first surface of the substrate to a second surface of the substrate during a soldering operation
Data Source
AI summary
An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.