Electronic Control Unit Thermal Management for Electric Power Steering
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Solution Overview
Problem
Existing electronic control units for electric power steering systems inefficiently dissipate heat from high-heat-generating devices like switching devices, relays, and coils, leading to increased temperatures and potential malfunctions.
Innovation Solution
The electronic control unit design includes a printed circuit board with high-heat-generating devices mounted on opposite surfaces, a heat-dissipating member, and a heat-conducting member that transfers heat efficiently from these devices to a heatsink, optimizing the arrangement of components within specific regions to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If high-heat-generating devices are mounted on the circuit board, then the electronic control unit can perform motor control functions, but heat accumulates and dissipation efficiency is poor
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by mounting high-heat-generating devices on both the front and back surfaces of the circuit board. This spatial arrangement enables heat to be conducted to heat-dissipating members located at different positions (front surface heat-dissipating member and back surface heat-dissipating member), effectively utilizing the third dimension (board thickness direction) to improve heat dissipation efficiency.
Solution Approach 2:
The patent divides the heat dissipation system into multiple independent heat-dissipating members positioned at different locations on the circuit board. Specifically, it includes a front surface heat-dissipating member for devices on the front surface, a back surface heat-dissipating member for devices on the back surface, and side surface heat-dissipating members. This segmentation allows each heat-generating device to have its own dedicated heat dissipation path, improving overall heat dissipation efficiency.
2Volume of moving object
If the electronic control unit size is reduced for compactness, then installation space is saved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes the thickness direction of the circuit board as an additional dimension for heat dissipation. By placing heat-dissipating members on both the front and back surfaces of the board, and extending heat-conducting members in the thickness direction, the system achieves efficient heat dissipation within a compact volume, effectively transforming a two-dimensional heat dissipation problem into a three-dimensional solution.
Solution Approach 2:
The patent integrates heat-dissipating members directly with the circuit board structure, with heat-conducting members embedded within or closely coupled to the board. This nesting approach allows the heat dissipation system to be incorporated within the existing control unit envelope without significantly increasing its external dimensions, achieving compact design with effective heat dissipation.
3Temperature
If heat-conducting members are added to improve heat dissipation, then temperature control improves, but device complexity increases
Solution Approach 1:
The patent combines multiple heat-conducting members into integrated heat dissipation structures that serve multiple functions. The heat-conducting members are strategically positioned to conduct heat from multiple high-heat-generating devices to appropriate heat-dissipating members, thereby reducing the total number of separate heat conduction paths needed while maintaining effective heat dissipation from all heat-generating devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation efficiency, reducing the risk of malfunctions and allowing for a smaller, more compact electronic control unit suitable for electric power steering systems.
Implementation Method 1
The heat-conducting member is located between the board and the heat-dissipating member and in contact with the high-heat-generating devices to transfer the heat of the high-heat-generating devices to the heat-dissipating member
Data Source
AI summary
In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.